The Status and Development of Oxidation of Copper Alloy for Lead Frame

黄福祥,马莒生,宁洪龙,黄乐,韩振宇,徐忠华
DOI: https://doi.org/10.3321/j.issn:1001-9731.2002.01.009
2002-01-01
Journal of Functional Biomaterials
Abstract:The lead frame share of copper alloys has increased to roughly 80% of total market due to their excellent thermal and electrical performance. Recently much more attention has been paid to adherence of the oxide film to the copper alloy lead frame substrate because this is thought to be related with crack or delamination of package that occurs in assembly process. A few materials researcher investigated the oxidation of copper alloys and its effect to adhesion of copper and epoxy molding component (EMC). In this paper, the structure and dynamics of copper alloy for lead frame, influence of adhesion of copper alloys and EMC are summarized.
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