Chip-levelVacuum Package and Test of Resonant MEMS Electric Field Sensor

Zheng-wei Wu,Chun-rong Peng,Peng-fei Yang,Xiao-long Wen,Bing Li,Shan-hong Xia
DOI: https://doi.org/10.11999/JEIT150105
2015-01-01
Abstract:In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.
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