A Fluctuation Model for RRAMs Based on HfO2 Material

Cong FANG,Linan LI,Feng ZHANG
DOI: https://doi.org/10.13911/j.cnki.1004-3365.2017.06.025
2017-01-01
Abstract:A RRAM (Resistive Random Access Memory) device based on HfO2 material was fabricated,which showed outstanding nonvolatility.A dynamic Verilog-A model obeyed ECM (ElectroChemical Metallization) conductive filament mechanism was demonstrated.The fluctuation of the conductive filament growth was added to this model.The model was verified by DC voltage scanning.The simulation and experimental data were compared by using the data processing software.Verified results indicated that the proposed model performed a good electrical characteristics of RRAM device.The fluctuation of RRAM model provided a reference for the preliminary design of peripheral circuits.The model was simulated using pulse voltage.With simulation results,the difference between LRS (Low Resistance State) and HRS (High Resistance State) was greater than a hundred-fold,and the transition time was less than 30 ns.
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