Abstract:Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits, it is attracting increasing attention from industries. With the commercialization of Micro LED technology, the following hurdles are identified: wafer manufacturing, full color, bonding, and mass transfer. Among them, mass transfer is so far considered as the most severe bottleneck. Several mass transfer technologies have emerged, including fine picking and placing, roll printing, laser transferring, and fluid self-assembly, which aim to solve the mass transfer problems. However, the aforementioned first 3 types of technologies still rely on the pick-and-place process, which is limited when the Micro LED die dimension shrinks to smaller scales due to processability and equipment precision. Fluidity self-assembly, on the other hand, will not be constrained by the Micro LED size and machine accuracy in the mass transfer process, which received increasing attention from researchers. In the self-assembly of component level, gravitational attraction, magnetic /electromagnetic fields, and capillary force are considered the mainstream force to facilitate the assembly process. Therefore, the component self-assembly becomes a prospective substitute for the Micro LED mass transfer solution, which overcomes the problems of the trade-off between throughput and the placement accuracy of the pick-and-place technology.

A Novel Micro-Component Assembly Technology-Fluidic Self-Assembly

Uni-direction Orienting and Size Effect Automatic Alignment Using Capillary Based in Fluidic Self-Assembly Process

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

The Mechanism And Feasibility Of Self-Assembly With Capillary Force

Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Self-Assembly in Micro- and Nanofluidic Devices: A Review of Recent Efforts

Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms

Self-assembly technology of nano-particle driven by the micro force

Flexible Microassembly Methods for Micro/nanofluidic Chips with an Inverted Microscope

Orientation-Specific Fluidic Self-Assembly Process Based on A Capillary Effect

Large-scale programmable assembly of functional micro-components for advanced electronics via light-regulated adhesion and polymer growth

An Automatic Microassembly Workcell for Pmma Microfluidic Chip Packaging

The state of art on the micro-joining and nano-joining technologies

Numerical Studies on Micropart Self-Alignment Using Surface Tension Forces

Current Status and Applications of Micro-assembly Technology

Microfluidic On-Demand Engineering of Longitudinal Dynamic Self-Assembly of Particles.

Flash technology-based self-assembly in nanoformulation: Fabrication to biomedical applications

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Automated Fluidic Assembly of Microvessel-Like Structures Using a Multimicromanipulator System

Micro-Assembly System for the Alignment of Micro-Nanofluidic Chips

Three-dimensional fluidic self-assembly by axis translation of two-dimensionally fabricated microcomponents in railed microfluidics