Automatic Microassembly System for MEMS Pressure Sensor Packaging

C. Tao
Abstract:An automatic microassembly system for MEMS pressure sensor packaging was developed.In order to analyze the influences of assembly precision on the sensibility,linearity and other capabilities of sensor,the packaging process of MEMS pressure sensor was introduced in detail.The automatic assembly system consists of a micro force sensor integrated micromanipulator,a bonding centre with three working cells,and a microscopic vision module.Through analyzing the sym-metry characteristics of graph of welding points on the chip,a detection method was given for locating chip centre,which lays a foundation for automatic assembly with high precision.At last,the automatic assembly system was developed and the time distributing in a manufacturing cycle was provided.Experimental results prove that the system has 5μm precision and 25 s/chip efficiency,and can be used for many other packaging tasks.
Engineering,Materials Science
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