Research on Bonding Technology Based on PMMA Material

Cheng-hong LI,Hong WANG,Shou-xin WANG,Jian-guo CUI
DOI: https://doi.org/10.3969/j.issn.1005-5770.2018.02.027
2018-01-01
Abstract:Polymethyl methacrylate (PMMA) is a common polymer used for microfluidic chips, which bonding process is essential for the making of microfluidic chips.In order to effectively achieve bonding PMMA in common laboratory, a convenient, low-cost and efficient PMMA bonding method was studied.Through orthogonal experimental design, the effects of bonding time, temperature and pressure on bonding strength of PMMA were investigated, so the optimum combination of process parameters was determined.The experimental results show that with the bonding temperature of 115 ℃, the bonding time of 70 min and the bonding pressure of 60 N, the bonding strength of 4.44 MPa can be reached and micro flow channel shave less distortion (less than 10%).It can meet the requirements of conventional PMMA microfluidic chip bonding packaging, and can be effectively carried out in the general microfluidic laboratory.
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