Optimization of Photoelectron In-Situ Sensing Device in FD-SOI

J. Liu,M. Arsalan,A. Zaslaysky,S. Cristoloveanu,J. Wan
DOI: https://doi.org/10.1109/s3s46989.2019.9320677
2019-01-01
Abstract:Previously, we demonstrated a photoelectron in-situ sensing device (PISD) used as one-transistor active pixel sensor (APS) fabricated in advanced 22 nm FD-SOI technology. In this work, we employ TCAD simulation to systematically study the impact of device parameters on its performance. The buried oxide (BOX) thickness and active device length (L-A) exert a strong impact on the sensitivity and sensing range of the PISD.
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