Abstract:The purpose of this study was to investigate the effects of the microstructure and properties of Cu/Ni multilayer films prepared by magnetron sputtering and electroplating on the electrical explosion performance of the films. In this study, Cu/Ni multilayer films of the same thickness were prepared by electroplating (EP) and magnetron sputtering (MS), and their morphology and crystal structure were characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM). XRD was used to observe the crystal structure and size of the samples. In addition, the Cu/Ni multilayer film was etched into the shape of a bridge, and the electric explosion phenomenon in the same discharge circuit of the multilayer foil obtained by the two preparation processes was tested by an electric explosion performance test system. The resistance–time curve and the energy–resistance curve during the electric explosion process were analyzed and calculated. The results showed that compared with the multilayer film prepared by the MS method, the crystal size of the multilayer film prepared by the EP method is smaller and the interface of Cu/Ni is clearer. In the electric explosion experiment, the MS samples had earlier burst times, larger peak resistances, smaller peak energies and higher ionization voltages. Through observation of the morphology of the samples after the electric explosion and combination with gas ionization theory, the internal influencing factors of the peak voltage and the relative resistance of the two samples were analyzed. The influence of the multilayer film mixing layer thickness on the sample energy conversion efficiency was analyzed by modeling the microstructure of the multilayer film exploding foil and electric heating. The results show that the thicker the mixing layer is, the more energy is distributed on the Ni, the faster the resistance increases, and the higher the energy conversion efficiency.

Study on Film Resistivity of Energy Conversion Components for MEMS Initiating Explosive Device

Design, Fabrication And Measurement Of Tan Thin Film Resistor Based On Mems Technology

Study on theoretical model for electrical explosion resistivity of Al/Ni reactive multilayer foil

Study on the Design of Bridge Microstructure for Energy Conversion Components

Micromechanical characterization of electroplated permalloy films for MEMS

Study on Electrical Explosion Properties of Cu/Ni Multilayer Exploding Foil Prepared by Magnetron Sputtering and Electroplating

Effects of microstructure on mechanical and energy release properties of Ni–Al energetic structural materials

Electro-explosive Characteristics of An Energetic Semi-conductor Bridge by Integrating Al/MoO3Reactive Multilayer Films with Various Modulation Ratio

Enhanced Energetic Performances Based on Integration with the Al/PTFE Nanolaminates

Core–Shell Copper Azide-Based Nanofiber Films Prepared by Coaxial Electrospinning for MEMS Microinitiators

Fabrication and Performance Characterization of Al/Ni Multilayer Energetic Films

Evolution of Conductive Filament and Its Impact on Reliability Issues in Oxide-Electrolyte Based Resistive Random Access Memory

A Micro-Tensile Method for Measuring Mechanical Properties of Mems Materials

In-situ synthesis of MEMS compatible Al/Cu2HIO6/PVDF Metastable composites film with high combustion performance

Flexible Conductive Energetic Film Based on Energetic Ionic Liquids and Carbon Nanotubes for Information Security Transient Electronics

Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses

Tuning the Ignition Performance of A Microchip Initiator by Integrating Various Al/Moo3 Reactive Multilayer Films on A Semiconductor Bridge

Characteristics of the Energetic Micro-initiator Through Integrating Al/Ni Nano-multilayers with Cu Film Bridge

Energetic Films Realized by Encapsulating Copper Azide in Silicon-based Carbon Nanotube Arrays with Higher Electrostatic Safety

Failure analysis from microcracks to a dominant crack in MEMS thin films using combined damage and fracture mechanics

Study on failure behavior of conductive and corrosion-resistant conversion film on magnesium alloy in damp-heat environment