Electromagnetic Coupling Field Strengthening of WC-TiC-Co Cermet Tools

Min Yuan,Jie Wang,Li Wang,Fu Zhong,Kunlan Huang,Yankang Tian
DOI: https://doi.org/10.1016/j.ceramint.2020.09.232
IF: 5.532
2020-01-01
Ceramics International
Abstract:This work proposes the application of pulsed electromagnetic coupling field processing (EMCFP) to enhance the lifetime and cutting performance of WC-15TiC-6Co cermet tool for the first time. Firstly, the developed electromagnetic field coupling equipment is introduced, the treatment process is analyzed, and the magnetization characteristics of WC-15TiC-6Co cermet tool are evaluated. Secondly, the strengthening effect of the EMCFP treatment is demonstrated by mechanical properties testing and cutting experiments, which reveal that the optimally treated tools exhibit a fracture toughness increased by 18%, an average cutting temperature decreased by 10%, and a friction coefficient for the rank face decreased by 7.9%. Collectively, these enhancements result in a tool lifetime increased by a factor of 1.92 relative to the lifetime of untreated tools. In addition, the results of simulation demonstrate that the simultaneously pulsed magnetic and electric fields contribute toward greater magnetic flux density and current density on the surface of the WC-15TiC-6Co cermet tool than would be obtained from the magnetic and electric fields alone.
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