Further Study of Sub-Tg Heat Flow Transition of a Cured Epoxy Resin

XX Chen,SJ Li
DOI: https://doi.org/10.1002/1521-3927(20010301)22:5<349::aid-marc349>3.0.co;2-x
1998-01-01
Abstract:To further study the sub-Tg heat flow transition of a cured epoxy resin, cured samples with different thermal history were investigated using torsion pendulum analysis (TPA) and thermal mechanical analysis (TMA). The results indicate that sub-Tg heat flow transition could be related to the molecular relaxation from 20°C to the α-peak, and that frozen-in extra free volume is necessary for the appearance of sub-Tg heat flow transition.
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