Analysis of Heat-resistance Properties in Thermosetting Resins Measured by Different Method

Ren-xin XU,Qing-hai YANG,Jun WANG,Xiang WANG,Xiao-li YANG
DOI: https://doi.org/10.3963/j.issn.1674-6066.2007.04.004
2007-01-01
Abstract:The heat-resistance properties of different thermosetting resin cured systems were measured by heat distortion temperature method(HDT),differential scanning calorimetry(DSC) and dynamic mechanical analysis(DMA).The differences of the measured results were analyzed as well as the relationship between the heat-resistance properties and the physical mechanism of the measured method.The results showed that the heat-resistance temperature obtained by the inflexion of modulus curve in DMA spectrums was anastomosed with the heat distortion temperature.The peak temperature of the dissipation curve in DMA spectrums was a little lower than the glass transition temperature by DSC.
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