Thermal Mechanical Properties and Curing Kinetics of Resorcinol Diglycidyl Ether/m-Xylylene Diamine

Qingxu Yang,Fei Xiao
2012-01-01
Abstract:The thermal and mechanical properties of a fast curing system,resorcinol diglycidyl ether/m-xylylene diamine(RDGE/XDA),were investigated by means of thermal analysis techniques.The results of dynamic mechanical analysis(DMA) and thermo-mechanical analysis(TMA) show that the glass transition temperature of RDGE/XDA is 83 ℃,and the storage modulus at room temperature is 2600 MPa.The coefficients of thermal expansion corresponding to the glassy and rubbery state is 54.9×10-6 ℃-1 and 177.9×10-6 ℃-1,respectively.The apparent activation energy obtained through isothermal and non-isothermal differential scanning calorimetry(DSC) measurement is 62.7 kJ/mol.Thus,the curing process of RDGE/XDA takes only a few seconds at 160 ℃ estimated from the curing rate at lower temperature and the apparent activation energy.
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