Study on curing kinetics of TDE-85 epoxy resin by means of DSC and DMA

Wu Shi-zhen
Abstract:Based on DSC and DMA curves,curing kinetic parameters of TDE-85/THPA epoxy resin system were calculated by means of several thermoanalysis methods,such as Kissinger,Flynn-Wall-Ozawa and Friedman-Reich-Levi.The activation energy calculated by Kissinger equation is the lowest,and the values of activation energy calculated by other methods are close with relative error within ten percent.The Gaussian distribution was applied to the peak separation.Kinetic parameters for each reaction were calculated.The simulation results agree well with DSC curves.Double peaks show that curing process contains two-step reactions.Activity of the glycide group is higher than that of cycloaliphatic epoxy groups.Through extrapolation method,curing process is defined as 100 ℃/6 h+130 ℃/4 h+160 ℃/2 h.
Materials Science
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