DSC and curing kinetics of epoxy resin using cyclohexanediol diglycidyl ether as active diluents

Cheng Li,Mei-Hua Liu,Zhi-Yong Liu,Mu-Lan Qing,Guo Wang
DOI: https://doi.org/10.1007/s10973-013-3471-y
IF: 4.755
2013-12-10
Journal of Thermal Analysis and Calorimetry
Abstract:Curing reactions of epoxy resin (diglycidyl ether of bisphenol-A) with curing agent polyamido-amine, using cyclohexanediol diglycidyl ether as active diluents, was investigated by non-isothermal differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method, and the results showed that Ea changed from 68.01 to 54.84 kJ mol−1 after the diluents was added, which reduced about 20 %. Málek method was used to deduce the probable mechanism function and the results indicated that Šesták–Berggren model is fairly coincident with the experimental data.
chemistry, physical, analytical,thermodynamics
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