Research on Curing Reaction Kinetics of Epoxy Resin/Hollow GlassMicrospheres System by Non-isothermal DSC Method

Xiang LI,Xian-hui LI,Ying-qi MA
DOI: https://doi.org/10.11973/lhjy-wl201704004
2017-01-01
Abstract:The curing reaction process of epoxy resin/4,4′-diamino diphenyl methane (EP/DDM) system filled with hollow glass beads (HGB) was tracked by differential scanning calorimetry (DSC) method under non-isothermal condition.The kinetics parameters of the curing system were calculated and the curing process conditions were determined.The results indicate that the apparent activation energy of the EP/DDM/HGB system was 51.21 kJ·mol-1,and the reaction order was 0.91.In contrast with pure epoxy resin,the initial temperature of curing reaction for EP/DDM/HGB system was 7-12 ℃ lower,meanwhile the peak temperature of the curing reaction was 4-6 ℃ lower.And there was also a decline on the reaction enthalpy of EP/DDM/HGB curing system.
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