Influence of Dry Etching Damage on the Internal Quantum Efficiency of Nanorod Ingan/Gan Multiple Quantum Wells

Yu Zhi-Guo,Chen Peng,Yang Guo-Feng,Liu Bin,Xie Zi-Li,Xiu Xiang-Qian,Wu Zhen-Long,Xu Feng,Xu Zhou,Hua Xue-Mei,Han Ping,Shi Yi,Zhang Rong,Zheng You-Dou
DOI: https://doi.org/10.1088/0256-307x/29/7/078501
2012-01-01
Chinese Physics Letters
Abstract:The influence of dry etching damage on the internal quantum efficiency of InGaN/GaN nanorod multiple quantum wells (MQWs) is studied. The samples were etched by inductively coupled plasma (ICP) etching via a self-assembled nickel nanomask, and examined by room-temperature photoluminescence measurement. The key parameters in the etching process are rf power and ICP power. The internal quantum efficiency of nanorod MQWs shows a 5.6 times decrease substantially with the rf power increasing from 3W to 100 W. However, it is slightly influenced by the ICP power, which shows 30% variation over a wide ICP power range between 30W and 600 W. Under the optimized etching condition, the internal quantum efficiency of nanorod MQWs can be 40% that of the as-grown MQW sample, and the external quantum efficiency of nanorod MQWs can be about 4 times that of the as-grown one.
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