Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Large Deviation from Matthiessen'S Rule in Chemical Vapour Deposited Copper Films and Its Correlation with Nanostructure

Evaluating size effects on the thermal conductivity and electron-phonon scattering rates of copper thin films for experimental validation of Matthiessen's rule

Effects of nanoscale surface roughness on the resistivity of ultrathin epitaxial copper films

Deviations from Matthiessen's Rule for ${\rm SrRuO_3}$ and ${\rm CaRuO_3}$

Study on elastic modulus of ultra-thin copper films by in-situ SEM-SPM nanoindentation

Observation of Metallic Resistivity Behavior Following A 1/Rho(300-K) Dependence of T(C) in A Yba2cu3o7-X Thin-Film with Varying Oxygen Deficiency

The Temperature and Size Effect on the Electrical Resistivity of Cu/V Multilayer Films

The microstructural dependence of the opto-electronic properties of nitrogenated hydrogenated amorphous carbon thin films

Diluting and Annealing Effects on Electromigration and Morphology of Chemical Vapor-Deposited Copper Films

Deviations from Matthiessen rule and resistivity saturation effects in Gd and Fe

THE TEMPERATURE COEFFICIENT OF RESISTANCE IN ULTRATHIN, EVAPORATED METAL FILMS (INVESTIGATION OF METAL THIN FILM FORMATION AND STRUCTURE)

Constrained Diffusional Creep in UHV-produced Copper Thin Films

Matthienssen's rule in polycrystalline metallic nanofilms

In situ resistivity study of copper–cobalt films: precipitation, dissolution and phase transformation

Temperature dependence of Magnetic properties in Nanocrystalline copper ferrite thin films

Why Matthiessen's rule is violated in the high-$T_{c}$ cuprate superconductors?

Separated transport relaxation scales and interband scattering in SrRuO$_3$, CaRuO$_3$, and Sr$_2$RuO$_4$ thin films

Characterization of Chemical Vapor Deposited Copper Films on Mercaptan Self-Assembled Monolayer Diffusion Barriers

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

Magnetoresistance and surface roughness study of electrodeposited Ni50Co50/Cu multilayers

Constrained Grain Boundary Diffusion in Thin Copper Films