An In-Situ TEM Investigation on Microstructure Evolution of Ni-25 At.% Al Thin Films

P. Y. Li,H. M. Lu,S. C. Tang,X. K. Meng
DOI: https://doi.org/10.1016/j.jallcom.2008.12.024
IF: 6.2
2008-01-01
Journal of Alloys and Compounds
Abstract:The microstructure evolution of Ni-25at.% Al thin films prepared by magnetron co-sputtering is investigated by using in-situ transmission electron microscopy (TEM) study from room temperature to 750°C. The diffraction rings of both Ni and Al are present in the selected area electron diffraction (SAED) of as-deposited films, and then the diffraction ring of Al disappears when the films are heated up to 300°C. At 500 and 700°C, the diffraction rings and spots of L12 intermetallic Ni3Al phase are found, respectively, which means that the formation of ordered Ni3Al phase starts from 500°C. Moreover, it is found that the grain growth is relatively slow when the temperature is lower than 300°C, while all of normal grain growth, abnormal grain growth and annealing twinning occur at higher temperatures.
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