Micro temperature sensor chip provided with tungsten rhenium film thermocouple and manufacturing method of chip

Tian Bian,Zhang Zhongkai,Zheng Chen,Jiang Zhuangde
2015-01-01
Abstract:The invention discloses a micro temperature sensor chip provided with a tungsten-rhenium film thermocouple and a manufacturing method of the chip. The chip comprises a silicon carbide-based substrate and the film thermocouple bonded to the front surface of the silicon carbide-based substrate, wherein the film thermocouple consists of a tungsten-rhenium couple film anode and a tungsten-rhenium couple film cathode which are connected with an extending compensating line anode and an extending compensating line cathode respectively. The chip is based on the thermo-electric effect, can output the temperature in the form of an electric signal under high-temperature working conditions, and can measure the temperature according to the relation between the temperature and output voltage. Through comprehensive matched design of the structure and materials, problems of curling and breakage of previous micro-structures due to the uneven thermal stress are solved. With the adoption of the chip and the manufacturing method of the chip, a temperature sensor made of a large-Seebeck-coefficient material is realized, high-temperature-resistant long-term operation can be realized, the anti-oxidation effect can also be realized, and meanwhile, the problem of thermal stress matching is solved.
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