Analysis for Arbitrary Metallization Thickness of RF MEMS Coupled Microstrip Lines and Microstrip Lines

Jia-Hui Fu,Qun Wu
2007-01-01
Abstract:This paper describes a method to analyze arbitrary metallization thickness on a coupled microstrip lines and microstrip lines for RF MEMS passive device design. Using conformal mapping technique and magnetic-wall, quasi-static parameters closed-form expressions for metallization thickness of coupled microstrip lines and microstrip lines are determined. They are found to be accurate compared with the Agilent ADS LineCalc tool. By using this method, the even-odd mode impedance of coupled microstrip lines and impedance of microtrip lines for arbitrary metallization thickness can be obtained.
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