Abstract:In this paper, an efficient cascaded microwave network approach is presented for power and signal integrity analysis of multilayer printed-circuit boards (PCBs) and advanced electronic packages with multiple signal traces, multiple power-ground plates, multiple vias, and external loads such as decoupling capacitors. Each parallel-plate pair, which consists of two consecutive conductor plates functioning as either power or ground in the PCBs or packages, is modeled as one individual microwave network. Equivalent circuits are used in the microwave network to model the vias, and a parallel-plate impedance matrix is formulated to account for the wave interactions between the vias and the boundary of the PCB or package. If signal traces are present in a plate pair, a modal decomposition and recombination approach is employed to model two associated modes: the transmission line mode for the signal traces, and the parallel-plate mode for the power-ground plate pair. The microwave networks for each plate pair are finally cascaded together by enforcing the continuity of the voltages and currents at the via clearance holes in the conductor plate shared by two consecutive plate pairs. Numerical validation reveals that the cascaded microwave network approach produces accurate simulation results with much less central processing unit time and memory requirements than 3-D full-wave approaches.

Modal Analysis of Microstrip Lines Using Singular Value Decomposition Analysis of FDTD Simulations

Application of singular value decomposition on FDTD simulation result - a novel approach for modal analysis of complex electromagnetic problems

Dispersion characteristics of V-shaped microstrip lines

Skin and proximity effects of curved microstrip interconnects

Constitutive Parameter Effects In Some Multilayered Bianisotropic Microstrip Lines: Clarification Of Magnetic Groups Of Symmetry

FDTD modeling of 3D metal-LTCC structures for RF(MM)ICs

Hybrid FDTD Method for Studying Electromagnetic Coupling Effects of Transmission Line Networks

EMI Analysis of Multiscale Transmission Line Network Using a Hybrid FDTD Method

Effect of Diverse Anisotropy in Multilayer Superstrate-Substrates on Pulse Propagation in Shielded Microstrip Lines

Modeling electromagnetic wave coupling and mode conversion effects in multitwisted bundle of twisted-wire pairs (MTB-TWP) above ground plane

Analysis of Signal Propagation in High-Speed Differential Signal Lines with Full-Wave Time-Domain Technique

Method for system-level signal and power integrity modeling of high-speed electronic packages

Analysis of Electromagnetic Interaction Between Smooth and Corrugated Transmission Lines by Using a Circuit Model

Efficient Signal And Power Integrity Analysis By Using Modal Decomposition And Integral Equations

Modeling and Analyzing High-Order Modes in Periodic-Stub-Loaded Stripline for Wideband Filter Design

Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Sub-structure characteristic mode analysis of microstrip antennas using a global multi-trace formulation

Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD