Study on Separating Displacement Models for Component from Waste Printed Circuit Board

Xiang Dong,Wu Yujia,Yang Jiping,Long Danfeng,Mou Peng

DOI: https://doi.org/10.3969/j.issn.1004-132X.2016.11.004

2016-01-01

Abstract:Under conditions of melt solder,whether components might be disassembled was de-cided by the separating distance between components and the substrate (named as separating displace-ment)caused by removal force.Firstly,the models of separating displacement for surface mount de-vices (SMD)and through-hole devices (THD)were established under the conditions of vertical disas-sembly and horizontal disassembly.Secondly,based on the Laplace equation and the Newton’s equa-tion for hydrostatic pressure,tensile breaking height of solder was analyzed and modeled in vertical disassembly for 3 typical kinds of components and the programmed algorithm was elaborated in detail. Finally,to verify the models for tensile breaking height of the melted solder,based on SMD with mounting base experiments were performed and the results show that the models for tensile breaking height are effective for melting solder.Models of separating displacements for components will be helpful to quantify the distance between components and the substrate,which is helpful for preparing the dismantling process of waste PCBs.