Abstract:Waste Electrical and Electronic Equipment is one of the major waste streams in terms of quantity and toxicity, and a critical step in Waste Electrical and Electronic Equipment end-of-life processing is through disassembly. Compared with full disassembly, which is a sub-optimal solution due to its high operational cost, selective disassembly is more economic and practical as only selected parts with recycling potential are considered. In this article, a systematic selective disassembly approach for handling Waste Electrical and Electronic Equipment with a maximum disassembly profit in accordance to the Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances Directives has been developed. First, a space interference matrix is generated based on the interference relationship between individual components in the three-dimensional computer-aided design model of Waste Electrical and Electronic Equipment. A matrix analysis algorithm is then applied to obtain all the feasible disassembly sequences through the obtained space interference matrix in a three-dimensional environment. Second, an evaluation and decision-making method is developed to find out an optimal selective disassembly sequence from the obtained feasible disassembly sequences. The evaluation takes into account the disassembly profit and requirements of the Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances Directives, which regulate on recycling rates of different types of products and removal requirements of (1) hazardous, (2) heavy and (3) high-value components. Thus, an optimal solution is a selective disassembly sequence that can achieve the maximum disassembly profit, while complying with the Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances restrictions based on a brute-force search method. Finally, an industrial case on Changhong liquid crystal display televisions of the type LC24F4 is used to demonstrate the effectiveness of the developed approach.

Removal force models for component disassembly from waste printed circuit board

The Disassembly Model and Its Analysis of PCB by Vibration

Study on Separating Displacement Models for Component from Waste Printed Circuit Board

Waste Printed Circuit Boards Disassembly Based on Physical Methods and Its Experimental Verification

The disassembly process and apparatus of waste printed circuit board assembly for reusing the components

Experiments on Reuse-oriented Disassembly of Components from Printed Circuit Boards

Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components

Disassembling Approaches And Quality Assurance Of Electronic Components Mounted On Pcbs

Simultaneous Disassembly of PCBs Based on Components Reusability Assessment

Self-adapting Grinding Method for Dismounting Through-hole Mounted Components from Scrapped Printed Circuit Board

Exploring an Innovative Technology for the Dismantling and Preprocessing of Printed Circuit Boards

Heating Strategy for Waste PCB Disassembly Oriented to the Reuse of Disassembled Components

Ground Plane Effect on the De-embedding Accuracy for Surface Mount Devices

Modeling and Simulation of PCB Assembly under Board-Level Drop Impact

A systematic selective disassembly approach for Waste Electrical and Electronic Equipment with case study on liquid crystal display televisions

Analysis of Smt Decoupling Capacitor Placement in Electronic Packages Using Hybrid Modeling Method

Determining optimum disassembly sequences in electronic equipment

Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator

Quadratic Nonlinear Models for Optimizing Electrostatic Separation of Crushed Waste Printed Circuit Boards Using Response Surface Methodology.

Measuring the Recyclability of Electronic Components to Assist Automatic Disassembly and Sorting Waste Printed Circuit Boards

Review of Methods for PCB Panel Depanelization and Methods for Correct Assembly of Electronic Components on PCB Panels