Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

Effects of Cutting Parameters on the Subsurface Damage of Single Crystal Copper During Nanocutting Process

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper

Md Simulation of Nanocutting Process: Removal Mechanism, Defects Evolvement and Characterization

Deformation Mechanism of Diamond Nanocutting Single-Crystal Copper Using Molecular Dynamics Simulatio

Nanomachining Molecular Dynamics Simulation of Single Crystal Copper

Subsurface Defect Evolution and Crystal-Structure Transformation of Single-Crystal Copper in Nanoscale Combined Machining

Nano-Cutting Molecular Dynamics Simulation of a Copper Single Crystal

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Researching Nanometric Cutting of Copper Based on Molecular Dynamics

Multiscale Simulation of Nanometric Cutting of Single Crystal Copper and Its Experimental Validation

Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Subsurface defects structural evolution in nano-cutting of single crystal copper

Molecular Dynamics Analysis for the Influence of Corner Radius on Single Crystal Copper Nano-cutting Process

Influences Analysis of Nanometric Cutting Single-Crystal Copper Via Molecular Dynamics Simulation

Research on the Influence of Machining Introduced Sub-Surface Defects and Residue Stress Upon the Mechanical Properties of Single Crystal Copper

Molecular Dynamics Simulation of Nanometric Cutting of Polycrystalline Copper

Molecular Dynamics Simulation of Subsurface Deformed Layers in Afm-Based Nanometric Cutting Process

Effect of Fluid Media on Material Removal and Subsurface Defects Evolution of Monocrystal Copper in Nano-Cutting Process

MD Simulation of Effect of Crystal Orientation and Cutting Direction on Nanometric Cutting Using AFM Pin Tool

Study on Subsurface Layer of Nano-Cutting Single Crystal Tungsten in Different Crystal Orientations