Comparative Study on NBTI Kinetics in Si P-Finfets with B2H6-based and SiH4-based Atomic Layer Deposition Tungsten (ALD W) Filling Metal

Longda Zhou,Guilei Wang,Xiaogen Yin,Zhigang Ji,Qianqian Liu,Hao Xu,Hong Yang,Eddy Simoen,Xiaolei Wang,Xueli Ma,Yongliang Li,Zhenzhen Kong,Haojie Jiang,Ying Luo,Huaxiang Yin,Chao Zhao,Wenwu Wang
DOI: https://doi.org/10.1016/j.microrel.2020.113627
2020-01-01
Abstract:A comparative study on negative bias temperature instability (NBTI) is carried out in replacement metal gate Si p-FinFETs featuring atomic layer deposition (ALD) tungsten (W) filling metal using B2H6 and SiH4 precursors. A fast measurement technique is used to characterize the threshold voltage shift (ΔVT). The effect of ALD W filling metal process on ΔVT, generated interface traps (ΔNIT), pre-existing hole traps (ΔNHT), stress voltage, and temperature dependence of degradation is demonstrated. Comparing with their B2H6-based counterpart, SiH4-based devices show reduced ΔVT under identical stress conditions due to reduced ΔNHT and ΔNIT. SiH4-based devices exhibit a 1.5 times higher fluorine content at the interfaces and larger compressive strain in the channel than B2H6-based devices, which are found to be responsible for the reduced ΔNIT. A modeling framework is proposed to model the long-term time evolution of NBTI degradation, and the predicted maximum overdrive voltage is compared. SiH4-based devices exhibit superior reliability and a 20% improvement in the maximum operation overdrive voltage than B2H6-based devices, and can be implemented in the advanced CMOS technology.
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