Multiphysics Analysis Of The Busbar In Mmc Submodule Under Dc Pole-To-Pole Fault

Chen Yang,Fan Xie,Bo Zhang,Dongyuan Qiu,Yanfeng Chen
DOI: https://doi.org/10.1109/ICEMS.2019.8922543
2019-01-01
Abstract:The reliability of the submodule in the Modular Multilevel Converter (MMC) directly affects the stable operation of the converter. When the short-circuit current flows through the busbar, the excessive electromagnetic force and thermal stress are imposed to the busbar, which may cause the deformation or even breakage of the busbar. In this paper, the transient analysis of the coupled electric-magnetic-thermal-mechanical field of the busbar in the MMC submodule is carried out under the DC pole -to-pole short-circuit fault. The transient electromagnetic field distribution, temperature rise and displacement of the busbar are shown. The actual structure of the busbar is introduced, and the transient mathematical model of the coupled electric-magnetic -thermal-mechanical of the busbar is established. Then, professional multiphysics simulation software COMSOL is used for analysis. The results show that the deformation in the middle of the busbar is the most serious, and the stress at the corner of the busbar is large. The conclusions obtained can provide reference for the optimization design and reliability evaluation of the MMC submodule.
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