Rapid interconnects for 3D soft electronics

Wedyan Babatain

DOI: https://doi.org/10.1038/s41928-024-01282-1

IF: 33.255

2024-11-13

Nature Electronics

Abstract:Nature Electronics, Published online: 11 November 2024; doi:10.1038/s41928-024-01282-1 Soft three-dimensional vias for connecting multiple circuit layers can be rapidly created out of liquid metal using a selective photocuring and stratification method.

engineering, electrical & electronic

What problem does this paper attempt to address?

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Dong Hae Ho,Chenhao Hu,Ling Li,Michael D. Bartlett

DOI: https://doi.org/10.1038/s41928-024-01268-z

IF: 33.255

2024-10-25

Nature Electronics

Abstract:Nature Electronics, Published online: 24 October 2024; doi:10.1038/s41928-024-01268-z Multiple stair-like structures can be created in parallel by programmed curing of a photoresin containing liquid metal droplets, which then stratify and assemble to form soft electronic vias.

engineering, electrical & electronic
High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Bo Liang,Jinwei Wei,Lu Fang,Qingpeng Cao,Tingting Tu,Xuesong Ye

DOI: https://doi.org/10.1109/icsens.2018.8589772

2018-01-01

Abstract:A rapid and inexpensive method to produce stretchable liquid metal electronics with high resolution is introduced. Here, liquid phase gallium-indium (Gain) alloy is firstly patterned on a pre-stretched elastomer, followed by a natural shrinking process to achieve high resolution stretchable electronic components and interconnects. The idea is inspired from the inflation and deflation of patterned balloons. By a cascaded direct writing and transfer printing step, the printing resolution increases by 20 times on pre-stretched substrates. This rapid prototyping approach paves a new way for microscale printed stretchable electronics.
High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Bo Liang,Jinwei Wei,Lu Fang,Qingpeng Cao,Tingting Tu,Hangxu Ren,Xuesong Ye

DOI: https://doi.org/10.1021/acsomega.9b02440

IF: 4.1

2019-01-01

ACS Omega

Abstract:A rapid and inexpensive method to produce high-resolution liquid metal patterns and electronics on stretchable substrates was introduced. Two liquid-phase gallium-indium (GaIn) alloy patterns, conductive lines, and interdigitated electrodes, were directly written or shadow mask-printed on a prestretched elastomeric substrate surface. Then, the prestretched substrate was released to recover its original length, and thus, electronic patterns simultaneously shrank on it. After these patterns were transferred to another prestretched substrate by the stamp printing method, the patterning resolution was demonstrated to increase by totally 50 times for the two successive stretch-release-shrink operations. Additionally, the resistance of the handwritten liquid metal conductive line traces remained nearly unchanged during the stretching process, which is believed to be feasible for electrical connections in stretchable electronics. The rapid prototyping of a serpentine strain sensor was successfully demonstrated to be highly sensitive and repeatable with a stretching ratio ranging from 0 to 200%. The proposed method paves a new way to fabricate stretchable electronic devices with high patterning resolution.
Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

Wenbo Pang,Xu Cheng,Haojie Zhao,Xiaogang Guo,Ziyao Ji,Guorui Li,Yiming Liang,Zhaoguo Xue,Honglie Song,Fan Zhang,Zheng Xu,Lei Sang,Wen Huang,Tiefeng Li,Yihui Zhang

DOI: https://doi.org/10.1093/nsr/nwz164

IF: 20.6

2019-01-01

National Science Review

Abstract:The manufacture of 3D mesostructures is receiving rapidly increasing attention, because of the fundamental significance and practical applications across wide-ranging areas. The recently developed approach of buckling-guided assembly allows deterministic formation of complex 3D mesostructures in a broad set of functional materials, with feature sizes spanning nanoscale to centimeter-scale. Previous studies mostly exploited mechanically controlled assembly platforms using elastomer substrates, which limits the capabilities to achieve on-demand local assembly, and to reshape assembled mesostructures into distinct 3D configurations. This work introduces a set of design concepts and assembly strategies to utilize dielectric elastomer actuators as powerful platforms for the electro-mechanically controlled 3D assembly. Capabilities of sequential, local loading with desired strain distributions allow access to precisely tailored 3D mesostructures that can be reshaped into distinct geometries, as demonstrated by experimental and theoretical studies of ∼30 examples. A reconfigurable inductive-capacitive radio-frequency circuit consisting of morphable 3D capacitors serves as an application example.
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

Chiyen Kim,David Espalin,Min Liang,Hao Xin,Alejandro Cuaron,Issac Varela,Eric Macdonald,Ryan B. Wicker

DOI: https://doi.org/10.1109/access.2017.2773571

IF: 3.9

2017-01-01

IEEE Access

Abstract:2-D printed electronics have been the focus of intense research for the past two decades primarily focused on implementing electrical interconnect by dispensing conductive binder-based inks. More recently, traditional printed electronics processes have been leveraged within 3-D printed structures where components and interconnect are introduced during fabrication interruptions. The dielectric performance of 3-D printed materials compares well with traditional printed circuit board (PCB) dielectrics but one remaining challenge is the low conductivity of printed ink traces. The performance degradation is due to curing temperature limits imposed by the properties of the polymer substrates. Thermoplastics, such as ULTEM, can maintain form at over 200 °C, but production ink curing processes require 850 °C to provide an appropriate conductivity. Previous reports have described submerging wires with selective energy within a thermoplastic substrate upon which 3-D printing can continue uninhibited. As copper wires have the same conductivity as PCBs and can be implemented in a wide range of cross-sectional areas, 3-D printed electronics are now in a position to transform the electronics industry. This paper describes an inter-layer process to insert metal connection between layers—allowing for improved routing density and leveraging the geometries brought to bear by 3-D printing. Minimum placement distance between these 3-D printed vias was initially 1.5 mm, and the vias can connect layers separated by as much as 2.8 mm in the vertical build direction (z-axis). As the number of wires layers that can be fabricated is not as limited as traditional board lamination, complex routing can be realized within mass customized, arbitrary shapes.

computer science, information systems,telecommunications,engineering, electrical & electronic
Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Xiaolong Li,Cheng Yao,Yujie Zhou,Shuyue Feng,Zhengke Li,Yiming Cheng,Shichao Huang,Haoye Dong,Mengru Xue,Guanyun Wang

DOI: https://doi.org/10.1145/3613905.3651098

2024-01-01

Abstract:In Human-Computer Interaction, multi-material 3D printing is increasingly recognized for its capacity to produce conductive interactive objects. While various fabrication techniques have emerged in this domain, achieving the integration of highly conductive 3D structures within printed objects continues to pose a significant technical hurdle. Our study introduces Intercircuit, a novel integrated technique developed explicitly for fabricating highly conductive interactive objects. This method employs multi-material printing to form unified components along with their embedded structures of lower conductivity, enhancing conductivity through targeted plating. Distinct from traditional multi-material printing and surface conductivity augmentation methods, the Intercircuit method facilitates the creation of complex 3D circuitry while ensuring superior conductivity. Furthermore, this study introduces a supportive design tool aimed at aiding users in crafting conductive frameworks. Moreover, the practical application of this method is further elucidated through a series of case studies.
Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits

Rui Guo,Yang Zhen,Xian Huang,Jing Liu

DOI: https://doi.org/10.1016/j.apmt.2021.101236

IF: 8.663

2021-12-01

Applied Materials Today

Abstract:3D printing, well known by the public, is regarded as an important symbol of entering the next industrial revolution that is well suited for the development of 3D electronics. However, reducing the manufacturing cost and time of 3D electronics is still one of the biggest challenges for its wide application. With low melting point, high conductivity, and reversible stiffness, gallium-based liquid metals are of great importance in developing multifunctional 3D electronic circuits. While, most research only use liquid metal as filler in 3D channels, which greatly weakened the interface function of liquid metal. Here, we report a straightforward, practical, and rapid fabrication strategy for multifunctional 3D electronic circuits based on 3D printing and a spatially selective adhesion mechanism of liquid metal inks. This method is applicable to diverse 3D structures with various mechanical properties and material types. A series of electronic circuits were printed out, and conceptual experiments were performed to demonstrate and justify the working of the new approach. Because of the phase transition and contact welding, the liquid metal based 3D electronic circuits show excellent stiffness variation and assemblability, which are promising to fabricate complex flexible 3D electronic systems, reconfigurable 4D electronics, and variable stiffness robots.

materials science, multidisciplinary
On‐Demand Programming of Liquid Metal‐Composite Microstructures through Direct Ink Write 3D Printing

Aaron Haake,Ravi Tutika,Gwyneth M. Schloer,Michael D. Bartlett,Eric J. Markvicka

DOI: https://doi.org/10.1002/adma.202200182

IF: 29.4

2022-04-17

Advanced Materials

Abstract:Soft, elastically deformable composites with liquid metal (LM) droplets can enable new generations of soft electronics, robotics, and reconfigurable structures. However, techniques to control local composite microstructure, which ultimately governs material properties and performance, is lacking. Here a direct ink writing technique is developed to program the LM microstructure (i.e., shape, orientation, and connectivity) on demand throughout elastomer composites. In contrast to inks with rigid particles that have fixed shape and size, it is shown that emulsion inks with LM fillers enable in situ control of microstructure. This enables filaments, films, and 3D structures with unique LM microstructures that are generated on demand and locked in during printing. This includes smooth and discrete transitions from spherical to needle-like droplets, curvilinear microstructures, geometrically complex embedded inclusion patterns, and connected LM networks. The printed materials are soft (modulus < 200 kPa), highly deformable (>600 % strain), and can be made locally insulating or electrically conductive using a single ink by controlling the process conditions. These capabilities are demonstrated by embedding elongated LM droplets in a soft heat sink, which rapidly dissipates heat from high-power LEDs. These programmable microstructures can enable new composite paradigms for emerging technologies that demand mechanical compliance with multifunctional response.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
MorphingCircuit: An Integrated Design, Simulation, and Fabrication Workflow for Self-morphing Electronics.

Guanyun Wang,Fang Qin,Haolin Liu,Ye Tao,Yang Zhang,Yongjie Jessica Zhang,Lining Yao

DOI: https://doi.org/10.1145/3432232

2020-01-01

Abstract:Manufacturing nonplanar electronics often requires the integration of functions and forms through embedding circuit boards into three-dimensional (3D) shapes. While most popular solutions rely on cavities where electronics reside in forms of rigid circuit boards, other alternative approaches leverage 3D printing or layer lamination to create 3D electronics that often require expensive manufacturing processes and materials. Furthermore, many conventional methods are incompatible with complex geometries (e.g., surfaces that twist or have local minima). In response, we introduce MorphingCircuit, an integrated design, simulation, and fabrication workflow that combines electronic functions with forms through four-dimensional (4D) printing, which effectively reduces cost, production time, and e-waste. Specifically, we start by printing a flat substrate and assembling functional electronics on top of it. The flat structure will then self-morph into a preprogrammed 3D shape when triggered by external heating. Overall, our comprehensive 3D electronics fabrication pipeline encompasses the design, simulation, fabrication, and transformation, with which we hope to inspire designers, researchers, and makers to create conformal electronics on complex substrate geometries that were previously difficult or impossible to design or manufacture.
Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity

Guoqiang Li,Mingyang Zhang,Sanhu Liu,Man Yuan,Junjie Wu,Mei Yu,Lijun Teng,Zhiwu Xu,Jinhong Guo,Guanglin Li,Zhiyuan Liu,Xing Ma

DOI: https://doi.org/10.1038/s41928-022-00914-8

IF: 33.255

2023-01-31

Nature Electronics

Abstract:Nature Electronics, Published online: 30 January 2023; doi:10.1038/s41928-022-00914-8 Three-dimensional liquid metal structures can be created by manipulating ductile gallium–indium alloy wires that are then encapsulated in an elastomer and heated to recover their fluidity, and can remain in a liquid state for a range of temperatures due to a supercooling effect.

engineering, electrical & electronic
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias

Subir Ghosh,Yikai Zheng,Zhiyu Zhang,Yongwen Sun,Thomas F. Schranghamer,Najam U Sakib,Aaryan Oberoi,Chen Chen,Joan M. Redwing,Yang Yang,Saptarshi Das

DOI: https://doi.org/10.1038/s41928-024-01251-8

IF: 33.255

2024-10-10

Nature Electronics

Abstract:Nature Electronics, Published online: 09 October 2024; doi:10.1038/s41928-024-01251-8 Tiers containing graphene-based sensors and molybdenum disulfide-based processors can be vertically stacked using a monolithic integration process, with an interconnect density of 62,500 per mm2.

engineering, electrical & electronic
High-resolution, reconfigurable printing of liquid metals with three-dimensional structures

Young-Geun Park,Hyeon Seok An,Ju-Young Kim,Jang-Ung Park

DOI: https://doi.org/10.1126/sciadv.aaw2844

2019-06-21

Abstract:We report an unconventional approach for high-resolution, reconfigurable 3D printing using liquid metals for stretchable, 3D integrations. A minimum line width of 1.9 μm can be reliably formed using direct printing, and printed patterns can be reconfigured into diverse 3D structures with maintaining pristine resolutions. This reconfiguration can be performed multiple times, and it also generates a thin oxide interface that can be effective in preventing the spontaneous penetration of gallium atoms into different metal layers while preserving electrical properties under ambient conditions. Moreover, these free-standing features can be encapsulated with stretchable, conformal passivations. We demonstrate applications in the form of a reconfigurable antenna, which is tunable by changing geometeries, and reversibly movable interconnections used as mechanical switches. The free-standing 3D structure of electrodes is also advantageous for minimizing the number and space between interconnections, which is important for achieving higher integrations, as demonstrated in an array of microLEDs.
Three-dimensional printing of soft hydrogel electronics

Yue Hui,Yuan Yao,Qilin Qian,Jianhua Luo,Hehao Chen,Zheng Qiao,Yetian Yu,Liang Tao,Nanjia Zhou

DOI: https://doi.org/10.1038/s41928-022-00887-8

IF: 33.255

2022-12-20

Nature Electronics

Abstract:Nature Electronics, Published online: 19 December 2022; doi:10.1038/s41928-022-00887-8 Using a conductive silver–hydrogel ink, three-dimensional circuits can be printed into a supporting hydrogel matrix that has a temporary, fluid-like state before curing to make fully encapsulated hydrogel electronics.

engineering, electrical & electronic
Three-Dimensionally Printed Expandable Structural Electronics via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV

Ju-Yong Lee,Min-Ha Oh,Joo-Hyeon Park,Se-Hun Kang,Seung-Kyun Kang

DOI: https://doi.org/10.3390/polym15092003

IF: 5

2023-04-24

Polymers

Abstract:Three-dimensional (3D) printing has various applications in many fields, such as soft electronics, robotic systems, biomedical implants, and the recycling of thermoplastic composite materials. Three-dimensional printing, which was only previously available for prototyping, is currently evolving into a technology that can be utilized by integrating various materials into customized structures in a single step. Owing to the aforementioned advantages, multi-functional 3D objects or multi-material-designed 3D patterns can be fabricated. In this study, we designed and fabricated 3D-printed expandable structural electronics in a substrateless auxetic pattern that can be adapted to multi-dimensional deformation. The printability and electrical conductivity of a stretchable conductor (Ag-RTV composite) were optimized by incorporating a lubricant. The Ag-RTV and RTV were printed in the form of conducting voxels and frame voxels through multi-nozzle printing and were arranged in a negative Poisson's ratio pattern with a missing rib structure, to realize an expandable passive component. In addition, the expandable structural electronics were embedded in a soft actuator via one-step printing, confirming the possibility of fabricating stable interconnections in expanding deformation via a missing rib pattern.

polymer science
Through Si vias using liquid metal conductors for re-workable 3D electronics

M. Palmer,C. Ellis,George A. Hernandez,M. Hamilton,Daniel Martínez

DOI: https://doi.org/10.1109/ECTC.2013.6575756

2013-05-28

Abstract:This paper describes the design and fabrication of liquid metal interconnects (vias) for 2.5D and 3D integration. The liquid metal is gallium indium eutectic (78.6% Ga, 21.4% In) with a melting temperature of approximately 15.7 °C, which is introduced into via openings of a silicon interposer. This liquid metal interconnect technology can be integrated with existing interposer technologies, including capacitors and traditional (solid metal) through-silicon vias (TSVs). We anticipate that liquid metal interconnects can better accommodate thermal stresses and provide re-workability in case of chip failure or upgrade. We determined the liquid metal resistance to be 1.67 KΩ at room temperature and observed an increase in the resistance to 5.6 KΩ at 37°C.

Materials Science,Engineering
A Fast and Cost-Effective Transfer Printing of Liquid Metal Inks for Three-Dimensional Wiring in Flexible Electronics.

Ruiqi Zhao,Rui Guo,Xinlin Xu,Jing Liu

DOI: https://doi.org/10.1021/acsami.0c08931

IF: 9.5

2020-01-01

ACS Applied Materials & Interfaces

Abstract:The fluidity and high electrical conductivity of a liquid metal make it an excellent material for preparing flexible electronics. Here, we established a method utilizing a widespread laser-printing technique to manufacture 3D flexible electronics. Through digital constructing of liquid alloy-philic smooth toner on liquid alloy-phobic rough substrates, we have the liquid metal selectively adhered to the designed pattern. The liquid metal circuit can then be transferred to an uneven and deformable Ecoflex surface to form a 3D circuit. Computational fluid dynamics simulation was performed to interpret the printing mechanism of the liquid metal on a substrate with selected adhesion. Flexible electronics fabricated through this method reveal great performance and stability, opening up opportunities for office and home flexible electronics manufacture, especially for lighting, heating, and logistics. By making the full use of the laser printers, our method not only saves the cost and time in preparation but also identifies favorable prospects for the mature laser-printing industry to promote next-generation flexible electronics fabrication.
Additive Manufacturing of Conformable Electronics on Complex Objects Through Combined Use of Liquid Metal Ink and Packaging Material

Qin Zhang,Jing Liu

DOI: https://doi.org/10.1115/imece2013-66607

2013-01-01

Abstract:Conventional electronics manufacturing strategies are generally complicated, time, water, material and energy consuming. Besides, building an electronic device on a complex object generally requests a series of different connecting wires which would make the machine in a mess. Here from an alternative approach, we proposed an innovative method of realizing conformable electronic connection by the low melting point metal ink and the related flexible packaging material for quickly manufacturing electronics. The liquid metal ink could easily and directly be written on a series of complex surfaces and then coated with the packaging material which is to offer mechanical strength and prevent it from air oxygenization. For illustrating purpose, an electrical connection of LED circuit on cylindrical surface, concave, inclined structure, planes of right angle and sphere was demonstrated. Such optoelectronic device appears rather compact without any evident connecting wires exposing out. Further, a thermal cycle experiment (−40°C∼120°C) was designed to test the variation of the electrical properties of the working sample. It is disclosed that the conductive line covered by the packaging material has a temperature coefficient of 0.255 mΩ/°C (T0 = −16°C) and finally an increasing rate of only 4.24% in resistance after all thermal aging cycles. This electrical connection method is expected to have a significant impact in surface mount technology. Its applications will not only in industry but also can change the way we interact with each other and our everyday life.
Multinozzle 3D Printing of Multilayer and Thin Flexible Electronics

Yang Li,Rui Wang,Xiaoyang Zhu,Jianjun Yang,Longjian Zhou,Shuai Shang,Peng Sun,Wensong Ge,Quan Xu,Hongbo Lan

DOI: https://doi.org/10.1002/adem.202200785

IF: 3.6

2022-01-01

Advanced Engineering Materials

Abstract:Multilayer flexible electronics have broad applications in the fields of sensors, biomedicine, flexible displays, etc. The existing multilayer flexible electronic manufacturing methods are complicated and usually require multiprocess and multiequipment combinations for processing; especially, it is difficult to achieve integrated manufacturing. The increase in the overall thickness of multilayer flexible electronics also limits its flexibility, stretchability, and spatial density. Herein, a method for integrated multinozzle 3D printing of multilayer flexible electronics with thin structures is proposed and a new strategy for interlayer interconnection is presented. Printing high‐viscosity stretchable silver paste on the edge of the multilayer dielectric material and avoiding microholes and vertically printed conductive micropillar structures in traditional interlayer interconnection wires are discussed. The influences of process parameters on the fabrication of multilayer and thin flexible electronics are explored, and the minimum layer thickness for the fabrication of multilayer circuits is determined. A five‐layer flexible pressure sensor and two flexible electromagnetic actuators with different coils are fabricated, and the related performance tests of the two devices are carried out. The test results demonstrate that the proposed fabrication method of flexible electronics provides a high‐efficiency, low‐cost, and simple manufacture solution for the fabrication of multilayer and thin flexible electronics.
Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors

Zeba Khan,Dheepesh Gururajan,Peter Koltay,Sabrina Kartmann,Roland Zengerle,Zhe Shu

DOI: https://doi.org/10.1002/tee.24035

IF: 0.923

2024-02-19

IEEJ Transactions on Electrical and Electronic Engineering

Abstract:This paper presents layer‐by‐layer additive manufacturing (AM) of molten metal microdroplets and dielectric materials to fabricate multilayer hybrid circuit boards featuring interdigitated 3D capacitors. The printed metal lines have a low resistance of 5 mΩ/mm, 12 times lower than state‐of‐the‐art conductive inks. Exploiting the advantages of Sn‐based oxide as an ideal candidate for Electrical Energy Storage Systems (ESS), we successfully fabricated an out‐of‐plane capacitor module using a combination of polymer and metal materials. The fabrication process exhibited an exceptional aspect ratio of 16, illustrating the successful incorporation of 20 metal layers in the out‐of‐plane capacitor module. Q factor obtained for the 3D capacitor was in the range of 66–500. Additionally, a fully automated printing technique was employed to produce a multilayer hybrid electrical printed circuit board (PCB), eliminating the need for post‐processing. This streamlined approach presents an efficient and comprehensive solution for the one‐stop printing of intricate electrical circuits. © 2024 The Authors. IEEJ Transactions on Electrical and Electronic Engineering published by Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

engineering, electrical & electronic
Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Peng Sun,Jinbao Zhang,Xiaoyang Zhu,Hongke Li,Yang Li,Jianjun Yang,Zilong Peng,Guangming Zhang,Fei Wang,Hongbo Lan

DOI: https://doi.org/10.1002/admt.202200302

IF: 6.8

2022-04-28

Advanced Materials Technologies

Abstract:The direct ink writing (DIW) 3D printing method is used to print interconnection wires on polydimethylsiloxane (PDMS) flexible substrates to fabricate a highly integrated multilayer flexible and stretchable electronics. The fabricated multilayer flexible stretchable electronic devices have good flexibility and stretchability, which can open up new prospects for the practical application of multilayer stretchable electronics in various fields.Multilayer circuits, especially in stretchable electronic devices, are considered to be an effective way to integrate various components and modules for complex functions. However, the existing manufacturing methods for multilayer flexible and stretchable electronics have problems such as complex technology, expensive equipment, and low production efficiency. Here, a direct ink writing 3D printing method is proposed to fabricate multilayer stretchable electronic devices by using high‐viscosity stretchable silver paste as the material for interconnecting wires, and stretchable polydimethylsiloxane as the dielectric layer. The optimal range of printing parameters is explored to realize the stable and repeatable manufacturing of wires. A protective layer is printed on the interconnection wires and rigid components to connect the soft substrate and the rigid electronic components. The results show that stress concentration is reduced and stable electrical response of the device is achieved under more than 49% tensile deformation. Vertical interconnect accesses and arc‐shaped wires are applied to a multilayer flexible thermal imaging display device and a NE555 timer device, and the outcomes prove that the direct ink writing 3D printing method provides an efficient, simple, and low‐cost manufacturing method for fabricating multilayer stretchable electronics.

materials science, multidisciplinary

Rapid interconnects for 3D soft electronics

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits

On‐Demand Programming of Liquid Metal‐Composite Microstructures through Direct Ink Write 3D Printing

MorphingCircuit: An Integrated Design, Simulation, and Fabrication Workflow for Self-morphing Electronics.

Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity

Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias

High-resolution, reconfigurable printing of liquid metals with three-dimensional structures

Three-dimensional printing of soft hydrogel electronics

Three-Dimensionally Printed Expandable Structural Electronics via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV

Through Si vias using liquid metal conductors for re-workable 3D electronics

A Fast and Cost-Effective Transfer Printing of Liquid Metal Inks for Three-Dimensional Wiring in Flexible Electronics.

Additive Manufacturing of Conformable Electronics on Complex Objects Through Combined Use of Liquid Metal Ink and Packaging Material

Multinozzle 3D Printing of Multilayer and Thin Flexible Electronics

Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics