Abstract:Researchers introduce a novel subtractive fabrication technique for liquid metal (LM) wiring in stretchable electronics. The method involves parallel filling of microfluidic channels with LM, followed by targeted cutting through flood exposure of the entire circuit to hydrochloric acid vapor. This approach overcomes the limitations of existing additive LM patterning methods, and enables simultaneous high‐throughput, high‐resolution, and high‐density LM wiring. Advancements in biomedical research have spurred the development of stretchable electronic devices. While soft insulators are readily available, soft conductors with metal‐like electrical conductivity are rare. Gallium and its alloys, being nontoxic and intrinsically stretchable, are potentially ideal solutions. However, current additive liquid metal (LM) patterning methods face limitations in achieving high‐throughput, high‐resolution, and high‐density LM wiring. Here, a subtractive LM patterning method is developed to meet all these requirements simultaneously. The innovative method involves parallel filling a single continuous microfluidic mesh network with LM that short‐circuits all the pins and pads of a circuit, followed by parallel cutting of the unwanted short‐circuited interconnections using hydrochloric acid (HCl) vapor. Cutting locations are pre‐defined by designing narrower intersecting channels, leveraging capillary force for precise filling and cutting. The process is characterized using a multidimensional parametric study with varying LM line widths and HCl concentrations, and in situ impedance measurements to assess insulation performance. To showcase its high‐throughput capabilities, a mock circuit is used to successfully generate complex LM interconnects that connected hundreds of electrical pads. Finally, a stretchable LM circuit with a micro‐LED array is fabricated to demonstrate the practical application of this technology for massively parallel wiring in stretchable electronics.

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