Fast and scalable phase change materials Ti–Sb–Te deposited by plasma-enhanced atomic layer deposition

Hao Wang,Sannian Song,Zhitang Song,Zhiguo Zhou,Dongning Yao,Shilong Lv
DOI: https://doi.org/10.1007/s10854-019-02605-1
2020-01-01
Abstract:Current features of phase change memory (PCM) based on Ge2Sb2Te5 (GST) as a non-volatile memory is insufficient to meet the needs of storage class memory (SCM) such as extremely high-density, ultra-fast operating speed and long life cycle. In this study, Ti0.28Sb2Te3 (TST) device was fabricated based on atomic layer deposition (ALD) method and used as a phase change material. Due to the fast crystallization and low melting temperature of TST, the set speed can be reduced to 6 ns while the reset voltage can be decreased by 20% compared with GST-based device with the same cell structure. In addition, the ALD-deposited TST alloy showed a good gap-fill capability. These results indicate that the ALD-deposited TST film is a fast and scalable phase-change material applied to SCM.
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