Abstract:Nb-Si base alloys have attracted considerable attentions as the potential high temperature structural materials working in the service temperature range of 1200 similar to 1400 degrees C because of their high melting points (>1750 degrees C), moderate densities (6.6 similar to 7.2 g/cm(3)) and excellent high temperature strength. However, the mismatching between room temperature fracture toughness and high temperature strength has limited their practical applications. Directional solidification (DS) and alloying have been proved to be the effective methods to overcome this critical issue. The DS processes used to prepare Nb-Si base alloys included Czochralski directional solidification in a copper crucible, electron beam directional solidification, optical floating zone melting, integrally directional solidification and electromagnetic cold crucible directional solidification (ECCDS). The previous studies focused on the effect of process parameters on microstructure and mechanical properties in the steady-state growth region (SSGR). However, the microstructure in the SSGR was controlled by the solid-liquid interface, and the solid-liquid interface was controlled by process parameters. Therefore, the study about the effect of process parameters on solid-liquid interface was very important. In this work, the master alloy with the nominal composition of Nb-22Ti-16Si-3Cr-3Al-2Hf (atomic fraction, %) was prepared by vaccum non-consumable arc-melting first, and then induction skull melting. The DS experiments were performed in the ECCDS device equipped with a square water cooled copper crucible (internal dimension; 26 mmx26 mmx120 mm) and a Ga-In alloy pool. There were three processing parameters in ECCDS including heating power of power supply, withdrawal rate and holding time. The DS ingots were prepared according to the orthogonal test (L-9(3(3))). Instability degree was defined as the ratio of the height of solid-liquid interface to the width of the DS ingot. The results showed that there were three macroscopic morphologies of solid-liquid interfaces; the increase of holding time, decrease of withdrawal rate and elevation of heating power were conducive to keeping the solid-liquid interface macroscopic morphology planar. With the increase of withdrawal rate, primary dendrite arm spacing. (d(1)) and secondary dendrite arm spacing (d(2)) decreased gradually; with the increase of heating power, d(1) and d(2) increased gradually; with the increase of holding time, d(1) and d(2) increased first and then decreased. The higher withdrawal rate, lower heating power and less holding time were beneficial to refining the d(1) and d(2).

Microstructure Evolution and Property Changes of Al-Si-Cu Alloy by Controlling Directional Solidification Parameters

Microstructures and mechanical properties of directionally solidified multi-element Nb-Si alloy

Ultrasounds Induced Microstructure Transition and Improved Mechanical Property of Directionally Solidified Ternary Cu–Al–Ni Alloy

MICROSTRUCTURE AND SOLID/LIQUID INTERFACE MORPHOLOGY EVOLUTION OF INTEGRALLY DIRECTIONALLY SOLIDIFIED Nb-SILICIDE-BASED ULTRAHIGH TEMPERATURE ALLOY

Non-axially Oriented Dendritic Microstructures and Their Mechanical Characteristics of Single-Crystal Al-4.5%Cu Alloy

Microstructure Evolution of Directionally Solidified Al-Cu Alloys

Effects of Silicon and Thermo-Mechanical Process on Microstructure and Properties of Cu–10Ni–3Al–0.8Si Alloy

Dependence of microstructure and mechanical properties on solidification condition of directionally solidified Zn-55Al-1.6Si alloys

Effect of Processing Parameters on Solid-Liquid Interface of Nb-Si Base Alloy Fabricated by Electromagnetic Cold Crucible Directional Solidification

Microstructural Control and Mechanical Properties of Ti–47Al–2Cr–2Nb Alloy by Directional Solidification Electromagnetic Cold Crucible Technique

Microstructure Evolution and Mechanical Properties of a Directionally Solidified Nb-Ti-Si-Cr-Al-Hf-Dy Alloy

Microstructure Evolution and Mechanical Properties of Directionally Solidified Large Size Ti-47Al-5Nb-0.18C-0.3Si Alloy by Electromagnetic Confinement

Microstructure Evolution and Room Temperature Deformation of a Directionally Solidified Nb-Si-Ti-Cr-Al-Hf-Y Alloy

Investigation of macro/microstructure evolution and mechanical properties of directionally solidified high-Nb TiAl-based alloy

Microstructure evolution, Cu segregation and tensile properties of CoCrFeNiCu high entropy alloy during directional solidification

Microstructure evolution and solidification behaviour of Nb–16Si–22Ti–2Cr–2Al–6Hf alloy processed by directional solidification

Interfacial morphology evolution in directionally solidified Al-1.5%Cu alloy

Investigation of the As-Solidified Microstructure of an Al–Mg–Si–Cu Alloy

Microstructure Control and Creep Behavior of Ti-47Al-6Nb-0.1C Alloy by Directional Solidification

Characterization of Microstructures and Growth Orientation Deviating of Al2Cu Phase Dendrite at Different Directional Solidification Rates

Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures