Realization of Ultra-Scaled MoS 2 Vertical Diodes via Double-Side Electrodes Lamination
Wanying Li,Liting Liu,Quanyang Tao,Yang Chen,Zheyi Lu,Lingan Kong,Weiqi Dang,Wujun Zhang,Zhiwei Li,Qianyuan Li,Jie Tang,Liwang Ren,Wenjing Song,Xidong Duan,Chao Ma,Yuanjiang Xiang,Lei Liao,Yuan Liu
DOI: https://doi.org/10.1021/acs.nanolett.2c00922
IF: 10.8
2022-05-26
Nano Letters
Abstract:Schottky diode is the fundamental building blocks for modern electronics and optoelectronics. Reducing the semiconductor layer thickness could shrink the vertical size of a Schottky diode, improving its speed and integration density. Here, we demonstrate a new approach to fabricate a Schottky diode with ultrashort physical length approaching atomic limit. By mechanically laminating prefabricated metal electrodes on both-sides of two-dimensional MoS<sub>2</sub>, the intrinsic metal-semiconductor interfaces can be well retained. As a result, we demonstrate the thinnest Schottky diode with a length of 2.6 nm and decent rectification behavior. Furthermore, with a diode length smaller than the semiconductor depletion length, the carrier transport mechanisms are investigated and explained by thickness-dependent and temperature-dependent electrical measurements. Our study not only pushes the scaling limit of a Schottky diode but also provides a general double-sided electrodes integration approach for other ultrathin vertical devices.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology