Abstract:Void evolution is closely related to the damage and failure of materials under dynamic conditions, such as high strain rate. The rearrangement of atoms on the entire void surface results in microscopic plastic behaviors like dislocation emission and twinning on the surface and further macroscopic plastic flow nearby. In this work, molecular dynamics simulations are conducted to study the compression flow stress and the corresponding plastic behavior of nanovoid inside monocrystal tungsten as a function of crystallographic orientation, void size, and strain rate. Colorful plastic deformation mechanisms, like shear loops, prismatic dislocation loop, twinning, amorphization, etc., are observed at different strain rates and for compression along various crystallographic orientations. A Kelvin tetrakaidecahedron, formed before yielding, is utilized to determine the critical shear stress for initiation of plastic deformation on void surface within the framework of yield criterion and facture mechanics. A unified model is thus proposed based on the macroscopic hardening effect raised by plastic strain and strain rate, and the microscopic plastic behavior of dislocation emission related to the crystallographic orientation and nanovoid size. The newly proposed unified equation gives a good recount on the yield strength and plastic behaviors obtained from molecular dynamics simulations, but also shed lights on the future works of crack members, inclusions, voids, and porous materials at extremely high strain rate.

Atomic Simulation of Void Effect on the Microstructure Evolution and Internal Stress Transmission in Nanoindentation

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Atomistic Investigations of Single-Crystal Silicon with Pre-Existing Defects

Molecular dynamics simulation on nanoindentation response of a copper workpiece

Atomistic Simulations of the Effect of a Void on Nanoindentation Response of Nickel

Numerical and Experimental Studies of Deep Indentation on Single Crystals

Investigation on void growth and coalescence in single crystal copper under high-strain-rate tensile loading by atomistic simulation

Molecular Dynamics Simulations of Void Effect of the Copper Nanocubes under Triaxial Tensions

Atomistic modeling size dependence of nano-voided copper yielding under uniaxial tension

Effects of void shape and location on the fracture and plastic deformation of Cu (crystalline) /Cu 64 Zr 36 (amorphous) composites

Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper

A Molecular Dynamics Simulations Study of the Influence of Prestrain on the Pop-In Behavior and Indentation Size Effect in Cu Single Crystals

Computer experiments on nano-indentation: A molecular dynamics approach to the elasto-plastic contact of metal copper

A unified model for yield strength and plastic behavior of nanovoid evolution in tungsten based on molecular dynamics simulations

Molecular Dynamics Study on the Nano-Void Growth in Face-Centered Cubic Single Crystal Copper

MACRO- AND MICROSCOPIC APPROACHES TO PLANE STRAIN DEFORMATION STATES OF FACE-CENTERED CUBIC METALS UNDER WEDGE INDENTATION

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Coupling Effect of Twin Boundary and Void on the Mechanical Properties of Bulk Nanotwinned Copper: an Atomistic Simulation

Blocking Effect of Twin Boundaries on Partial Dislocation Emission from Void Surfaces

Experimental and numerical investigations of anisotropic plasticity response in polycrystalline copper by nanoindentation

Development of local plasticity around voids during tensile deformation