Abstract:Based on the embedded atom method (EAM) and molecular dynamics (MD) method, the mono-crystalline copper with different defects is investigated through tension and nanoindentation simulation. The single-crystal copper nanowire with surface defects is firstly studied through tension. For validation, the tension simulations for nanowire without defect are carried out under different temperatures and strain rates. The defects on nanowires are then systematically studied in considering different defects orientation distribution. It is found that the Young’s modulus is insensitive of surface defects and centro-plane defects. However, the yield strength and yield point show a significant decrease due to the different defects. Specially, the 〖45〗^° defect in surface and in (200) plane exerts the biggest influence to the yield strength, about 34.20% and 51.45% decrease are observed, respectively. Different defects are observed to serve as a dislocation source and different necking positions of the nanowires during tension are found. During nanoindentation simulation, dislocation is found nucleating below the contact area, but no obvious dislocation is generated around the nano-cavity. Comparing with the perfect substrate during nanoindentation, the substrate with nano-cavities emerged less dislocations, it is supposed that the nano-cavity absorbed part of the indent energy, and less plastic deformation happened in the defected substrate.

Molecular Dynamics Study on the Nano-Void Growth in Face-Centered Cubic Single Crystal Copper

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Atomistic Numerical Investigation of Single-crystal Copper Nanowire with Surface Defects

Exploration of the Defect’s Effect on the Mechanical Properties of Different Orientated Nanowires

Atomistic Exploration of Deformation Properties of Copper Nanowires with Pre-Existing Defects

Molecular Dynamics Study Of Dynamic Buckling Properties Of Nanowires With Defects

Numerical Exploration of Plastic Deformation Mechanisms of Copper Nanowires with Surface Defects

MD Investigations for Mechanical Properties of Copper Nanowires with and Without Surface Defects

Numerical Exploration Of The Defect'S Effect On Mechanical Properties Of Nanowires Under Torsion

Multiaxial Behavior of Nanoporous Single Crystal Copper: a Molecular Dynamics Study

Molecular Dynamics Study on the Nano-Void Growth and Coalescence at Grain Boundary

Investigation on void growth and coalescence in single crystal copper under high-strain-rate tensile loading by atomistic simulation

Surface Stress Effects On The Yield Strength In Nanotwinned Polycrystal Face-Centered-Cubic Metallic Nanowires

Atomistic modeling size dependence of nano-voided copper yielding under uniaxial tension

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

Molecular Dynamics Simulations of Void Effect of the Copper Nanocubes under Triaxial Tensions

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper

Coupling Effect of Twin Boundary and Void on the Mechanical Properties of Bulk Nanotwinned Copper: an Atomistic Simulation

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Studying the elastic properties of nanocrystalline copper using a model of randomly packed uniform grains