Abstract:We develop a new Voronoi protocol, which is a space tessellation method, to generate fully dense (containing no voids) nanocrystalline models of copper (Cu) with precise grain size control; we also perform uniaxial tensile tests using molecular dynamical (MD) simulations to measure the elastic moduli of the grain boundary and the grain interior components at 300 K. We find that the grain boundary deforms more locally compared with the grain core region under thermal vibrations and is elastically less stiff than the core component at finite temperature. The elastic modulus of the grain boundary is lower than 30% of that of the grain interior. Our results will aid in the development of more accurate continuum models of nanocrystalline metals.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the difference in elastic modulus between grain boundaries and grain interiors in nanocrystalline copper and their behavior at finite temperatures. Specifically, the research focuses on the following aspects: 1. **Developing a new Voronoi algorithm**: In order to generate a fully dense (void - free) nanocrystalline copper model with precisely controllable grain size, the authors developed a new Voronoi space - partitioning method. This method generates a uniformly distributed grain structure by using the center positions of randomly close - packed uniform spheres as Voronoi seeds. 2. **Measuring elastic modulus**: Uniaxial tensile tests were carried out using molecular dynamics (MD) simulations to measure the elastic modulus of grain - boundary and grain - interior components at 300 K. It was found that the grain boundaries deform more locally under thermal vibration and that the elastic modulus at finite temperatures is 30% lower than that of the grain - core components. 3. **Elastic properties of grain boundaries**: The paper explores the elastic behavior of grain boundaries at finite temperatures, especially their thermal sensitivity relative to the grain - core part. The results show that the grain boundaries exhibit more local deformation under the same thermal fluctuations, indicating that their elastic modulus is lower. 4. **Model verification**: Through verification of geometric, elastic, and plastic properties, as well as tests of the system's isotropy and finite - size effects, it was proven that the newly developed Voronoi model can reasonably reproduce the structural characteristics of actual nanocrystalline copper. 5. **Comparison of theoretical models**: The overall elastic modulus was fitted using the Voigt, Reuss, and Hill models, and it was found that the Reuss model best captures the elastic response of the system at finite temperatures. This further confirms the hypothesis that the elastic modulus of the grain boundaries is much lower than that of the grain - core components. Overall, this paper aims to gain a deep understanding of the elastic behavior of grain boundaries at finite temperatures through a nanocrystalline copper model with precisely controlled grain size, providing a basis for the development of more accurate continuous models of nanocrystalline metals.

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