Abstract:We developed a new platform that enables in-situ four-probe electronic measurements, in-situ three-probe field-effect measurements, nanomanipulation, and in-situ modification of nanodevices inside a transmission electron microscope (TEM). The platform includes a specially designed chip-holder and a silicon (Si) chip with suspended metal electrodes. The chip-holder can hold one Si chip with a size up to 3 mm x 3 mm and provides four electrical connections that can be connected to the micrometer-sized electrodes on the Si chip by wire-bonding. The other side of the electrical connections on the chip-holder is connected to the electronic instruments outside the TEM through a commercial Nanofactory SPM-TEM holder. The Si chip with suspended metal electrodes on one of its edges was fabricated by lithography and wet etching. Carbon nanotubes (CNTs), InAs nanowires, and tungsten disulfide nanowires were placed to stride over and connect to the suspended electrodes on the Si chip by nanomanipulations inside a scanning electron microscope (SEM). By using the platform, I-V curves of an individual single-walled CNT connecting to four electrodes were in-situ measured between any two of the four suspended electrodes, and a high-resolution TEM image of the same CNT was obtained. Furthermore, four-terminal I-V measurement on an InAs nanowire was achieved on this platform, and with a movable probe used as a gate electrode, field-effect measurement on the same InAs nanowire device was accomplished in SEM. In addition, by using the movable probe on the SPM-TEM holder, we could further in-situ modify nanomaterial and nanodevices. The present work demonstrates a method that allows a direct correlation between the atomic-level structure and the electronic property of nanomaterials or nanodevices whose structure can be further modified in-situ.

Developing Multifunctional and High Resolution In-situ TEM Holders

In Situ Cathodoluminescence and Monitoring Electronic Structure Change Using Optical TEM Holder

Development of in Situ Optical–electrical MEMS Platform for Semiconductor Characterization

Advanced In Situ TEM Microchip with Excellent Temperature Uniformity and High Spatial Resolution

In Situ Device-Level TEM Characterization Based on Ultra-Flexible Multilayer MoS2 Micro-Cantilever

Double-tilt in Situ TEM Holder with Ultra-High Stability

A platform for in-situ multi-probe electronic measurements and modification of nanodevices inside a transmission electron microscope.

Simultaneous atomic-level visualization and high precision photocurrent measurements on photoelectric devices by in situ TEM

Multi-Stimuli Operando Transmission Electron Microscopy for Two-Terminal Oxide-Based Devices

In Situ Device‐Level TEM Characterization Based on Ultra‐Flexible Multilayer MoS2 Micro‐Cantilever (Adv. Mater. 28/2023)

On-chip Gas Reaction Nanolab for in Situ TEM Observation.

Semi-custom Methodology to Fabricate Transmission Electron Microscopy Chip for in Situ Characterization of Nanodevices and Nanomaterials

Electrical, Optical and Ionic Probe Inside Transmission Electron Microscope

The design and fabrication of the in situ double-tilt sample holders for the transmission electron microscopy

Advanced preparation of plan-view specimens on a MEMS chip for in situ TEM heating experiments

A Hybrid Nanorobotic Manipulation Platform: A Sharing Holder Between a Cs-TEM and an SEM for Micro to Sub-nanometer Fabrication

Fabrication and Electric Measurements of Nanostructures Inside Transmission Electron Microscope

In-situ heating-and-electron tomography for materials research: from 3D ( in-situ 2D) to 4D ( in-situ 3D)

Operando two-terminal devices inside a transmission electron microscope

Fabrication of a liquid cell for in situ transmission electron microscopy

A Compact Design of Four-Degree-of-freedom Transmission Electron Microscope Holder for Quasi-Four-dimensional Characterization