Abstract:Micro-electro-mechanic-system (MEMS) devices on flexible substrate are important for non-planar and non-rigid surface applications. In this paper, a novel and cost-effective fabrication process for an 8×8 MEMS temperature sensor array with a lateral dimension of 2.5mm×5.5mm on a polyimide flexible substrate is developed. A 40μm thick polyimide substrate is formed on a rigid silicon wafer using as a mechanical carrier throughout the fabrication by four successive spin coating liquid polyimide. The arrayed temperature sensing elements made of 1200Å sputtered platinum thin film on polyimide substrate show excellent linearity with a temperature coefficient of resistance of 0.0028/°C. The purposed sensor obtains a high sensitivity of 0.781Ω/°C at 8mA at constant drive current. Because of the low heat capacity and excellent thermal isolation, the temperature sensing element shows excellent high sensitivity and a fast thermal response. The finished devices are flexible enough to be folded and twisted achieving any desired shape and form. Employing spin-coated liquid polyimide substrate instead of solid polyimide sheet minimizes the thermal cycling as well as improves the production yield. This fabrication technique first introduces the spin-coated PDMS (Polydimethylsiloxane) interlayer between the silicon carrier and the polyimide substrate and makes the polyimide-based devices separate much easier and greatly simplifies the fabrication process with a high production yield. A non-successive two-stage cure procedure for the polyimide precursor is developed to meet low-temperature requirement of the PDMS interlayer. The fabrication procedure developed in this research is compatible with conventional MEMS technology through an optimized integration process. The novel flexible MEMS technology can benefit the development of other new flexible polyimide-based devices.

Optimization of Die Bond Process Parameters of MEMS Thermopile Chip

Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

High-Temperature Piezoresistive Pressure Sensitive Silicon Chip and Electrostatic Bonding Process

Reliability Inspection for Bilayer Nanosilver Paste Ensemble Pressureless Sintered Embedded Cooling SiC Power Module

Automatic Microassembly System for Die Level Fabrication of MEMS Pressure Sensor

Low Temperature Eutectic Alloy Bonding Used in MEMS-Based Solid Propellant Microthrusters Array

Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor with Back-Inlet Package Structure

Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives

Surface Activated Bonding Method Applied in MEMS Pressure Sensor with TSV Structures

Investigation of Thermal Bonding on PMMA Capillary Electrophoresis Chip

Laser-heating Wire Bonding on MEMS Packaging

Optimization and Fabrication of MEMS suspended structures for nanoscale thermoelectric devices

A novel evolutionary method for parameter-free MEMS structural design and its application in piezoresistive pressure sensors

A Study of Partial Layout of Adhesive on the Thermal Drift of MEMS Capacitive Accelerometers

Optimization of Thin Metal Layer Etch Process for MEMS/Sensor Application*

Study on Anodic Bonding Process of Slender Vitreous Body

Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging

A Novel Fabrication Process of MEMS Devices on Polyimide Flexible Substrates

Mechanism Analysis of Process Parameters Effects on Bondability in Ultrasonic Ball Bonding

Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature