Abstract:Driven by the demand for computing power by artificial intelligence big data models, integrated circuit chips are developing in the direction of increasing the number of transistors and increasing the chip area, which results in an increase in power. Increased power of computing chips poses challenges for thermal management. In the trend of miniaturization of electronic devices, efficient heat dissipation of high-power electronic components in a restricted space is increasingly important. Single-phase liquid cooling with embedded microchannels in chips provides low thermal resistances and high-efficiency heat exchange in a compact manner. But at present embedded cooling is still in the laboratory stage, the liquid supply system used is large, the reliability test for the liquid supply system is less, and the embedded microchannel integrated cooling system with liquid supply capacity needs to be further miniaturized. In this paper, an integrated thermal management method integrating pump and embedded microfluidics for high power chips is proposed, and the prototype of the microsystem is designed and developed. The overall size of the system is less than 13 cm3. A platinum film resistor is designed on the surface of embedded microchannel chip to simulate the heat dissipation of an actual chip. The liquid supply part is manufactured by 3D printing technology. The cooling capability of embedded microchannel and the liquid flow reliability of integrated embedded microfluidic system were tested respectively. The results show that when the chip power is 206W, the chip surface temperature rise can be controlled below 75°C. Under the flow rate of 118ml/min, after 96 hours of continuous cooling test, the system shows no reliability problems such as leakage and structural damage. This work integrates the embedded microchannel liquid cooling system as a whole and miniaturizes the system on the premise of ensuring its heat dissipation ability and working reliability, which has practical significance to promote the integration and industrialization of embedded cooling.

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