Resistive Random Access Memory: Solving the Scaling Issue of Increasing Forming Voltage in Resistive Random Access Memory Using High‐k Spacer Structure (adv. Electron. Mater. 9/2017)

Yi‐Ting Tseng,Po‐Hsun Chen,Chang,Tsung‐Ming Tsai,Chih‐Cheng Shih,Hui‐Chun Huang,Cheng‐Chi Yang,Chih‐Yang Lin,Cheng‐Hsien Wu,Hao‐Xuan Zheng,Shengdong Zhang,Simon M. Sze
DOI: https://doi.org/10.1002/aelm.201770041
IF: 6.2
2017-01-01
Advanced Electronic Materials
Abstract:A rising forming voltage issue with scaling-down resistive random access memory (RRAM) device cells is successfully solved by introducing new high-permittivity (high-k) material as the side-wall spacer structure. As reported by Ting-Chang Chang, Kuan-Chang Chang, and co-workers in article number 1700171, both COMSOL-simulated electrical field and electrical measurements confirm the confined the electrical field by the surrounded high-k spacer. The cross section views clearly show the different structures with a spacer.
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