Direct Writing of Stable Cu–Ag-based Conductive Patterns for Flexible Electronics

Wei Li,Wenjiang Li,Mengmeng Wang,Guoxu Liu,Minfang Chen

DOI: https://doi.org/10.1039/c5ra25600c

IF: 4.036

2016-01-01

RSC Advances

Abstract:Particle packing density and sintering method are important to improve patterns' conductivity and mechanical properties at a low temperature 160 °C.

What problem does this paper attempt to address?

Synthesis of stable CucoreAgshell&Ag particles for direct writing flexible paper-based electronics

Wei Li,Yansong Wang,Mengmeng Wang,Wenjiang Li,Junjun Tan,Chen You,Minfang Chen

DOI: https://doi.org/10.1039/c6ra11965d

IF: 4.036

2016-01-01

RSC Advances

Abstract:Highly conductive flexible paper-based patterns were drawn directly using a brush pen dipped in ink consisting of copper-silver core-shell with individual silver (CucoreAgshell&Ag) particles. Using a cost-effective and green method, the formation of these CucoreAgshell&Ag particles is first driven by a transmetalation reaction on the surface of copper nanoparticles between copper atoms and silver ions, and then excessive Ag ions were further reduced by the glucose to form individual Ag nanoparticles. Characterization of these particles by XRD, SEM and TGA confirm the CucoreAgshell&Ag structure and their stability towards oxidation. The conductivity of the bending pattern was experimentally tested with different bending angles, bending cycles and bending storage times. It was found that the silver shell with external excessive Ag NPs not only improves the packing density, but also enhancing the particle purity results in the high conductivity of the bending pattern. Sintered at a low temperature of 160 degrees C and after 3000 bending cycles and storage for 300 days, the linear resistivity of the pattern increased from similar to 5 mu Omega cm to similar to 20 mu Omega cm, 4 times higher than before the pattern was bent, which is acceptable for conductive patterns in practical applications. Thus, this approach represents a promising method for the formation of microelectrodes or electronic devices with good flexibility and conductivity.
High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Bo Liang,Jinwei Wei,Lu Fang,Qingpeng Cao,Tingting Tu,Xuesong Ye

DOI: https://doi.org/10.1109/icsens.2018.8589772

2018-01-01

Abstract:A rapid and inexpensive method to produce stretchable liquid metal electronics with high resolution is introduced. Here, liquid phase gallium-indium (Gain) alloy is firstly patterned on a pre-stretched elastomer, followed by a natural shrinking process to achieve high resolution stretchable electronic components and interconnects. The idea is inspired from the inflation and deflation of patterned balloons. By a cascaded direct writing and transfer printing step, the printing resolution increases by 20 times on pre-stretched substrates. This rapid prototyping approach paves a new way for microscale printed stretchable electronics.
Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Xiaosheng Xie,Zijian Wu,Daocheng Pan,Xinan Shi

DOI: https://doi.org/10.1088/1742-6596/2785/1/012111

2024-07-04

Journal of Physics Conference Series

Abstract:Particle-free silver inks have the advantage of low sintering temperature, high stability, and easy synthesis over traditional nanoparticle-based silver inks, which have been widely applied in the printing electronic industry. In this paper, we develop a novel particle-free and ionic liquid-assisted silver ink consisting of silver acetate and formic acid/iso-propanolamine liquid that can be used to print highly conductive silver patterns at low sintering temperatures. A variety of continuous and consistent silver circuits with a resistivity of 7.7 μΩ·cm can be printed by a dispenser machine, which is only 4.8 times bulk silver. Furthermore, the low-resistivity silver patterns can be also printed on the flexible polyimide foil, which maintains the stability of resistivity and mechanical properties after bending multiple times, demonstrating that our ionic liquid-assisted silver ink can be applied in flexible electronic devices. Besides, our particle-free silver ink can be utilized to write electric circuits directly with a ball-point pen.
A Promising Approach to Conductive Patterns with High Efficiency for Flexible Electronics

Yan-Long Tai,Zhen-Guo Yang,Zhi-Dong Li

DOI: https://doi.org/10.1016/j.apsusc.2011.03.056

IF: 6.7

2011-01-01

Applied Surface Science

Abstract:A promising approach for conductive patterns with high efficiency for flexible electronics was developed by direct-writing, silver(I) solution (silver nitrate, acetate silver, etc.) with no solid particles as a conductive ink, conductive pen as a writing implement, and polyimide (PI) film as a substrate. The physical properties of the conductive ink were investigated by a dynamic contact angle system, ubbelohde viscometer and surface tension instrument. Conductive properties of silver ink film were investigated by 4-point probe, scanning electron microscope (SEM) and surface profilometer. It is demonstrated how the design of solvent composition in conductive ink affects surface morphology, and conductivity of silver ink films. It can be obtained that conductive patterns drawn on PI substrate not only have good mechanical/electrical fatigue properties, but also have low resistivity. Especially, when the sintering condition is 200 degrees C for 60 min, the resistivity can be down to 6.6 mu Omega cm, 4.25 times the silver bulk resistivity. (C) 2011 Elsevier B.V. All rights reserved.
Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Yanlong Tai,Zhenguo Yang

DOI: https://doi.org/10.1039/c0jm03065a

2011-01-01

Journal of Materials Chemistry

Abstract:A kind of conductive pen was designed, prepared with nano-silver colloid as the conductive ink and gel-ink pen as the writing implement, and used to draw conductive patterns on paper substrate by direct-writing for flexible electronics. Silver nanoink (20 wt%) was characterized using field emission transmission electron microscopy (FETEM), size distribution analyser (SDA), differential scanning calorimetry (DSC), X-ray diffraction (XRD) and selected-area electron diffraction (SAED). Paper-based conductive patterns were investigated by a surface profilometer, a 4-point probe, scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis. It can be found that silver nanoparticles have a small size, about 2.1 +/- 0.5 nm in diameter with monodispersity, and the melting point sharply decreased to 105 degrees C. A conductive line drawn on weighing paper not only had good mechanical/electrical fatigue properties, but also low resistivity. Especially, when the sintering condition is 200 degrees C for 60 min, the resistivity can be down to 6.8 mu Omega cm, 4.25 times the bulk resistivity. In addition, the reparation of conductive patterns and application in a practical circuit were also studied.
Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Ning Wang,Yangai Liu,Wei Guo,Chao Jin,Lefu Mei,Peng Peng

DOI: https://doi.org/10.1088/1361-6528/ab85ef

IF: 3.5

2020-05-12

Nanotechnology

Abstract:In this study, a transparent particle-free reactive silver ink was used to fabricate conductive patterns on flexible substrate. Thermal annealing and plasma irradiation at low temperature were utilized to improve the conductivity of as-printed patterns. The effects of sintering process parameters on the microstructure and resistivity of patterns were investigated. Under the optimized process conditions, the resistivity of pattern reached 1.2 ×10 -7 Ω · m by thermal sintering, while it was 8 ×10 -8 Ω · m after plasma sintering. Combined with these two sintering techniques, the resistivity was reduced to 6 × 10 -8 Ω · m, close to that of bulk silver. This work provides an alternative solution for fabricating of highly conductive feature patterns on common flexible substrates.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance

Wenwu Zhang,Yanhong Zhou,Yiping Ding,Linlin Song,Qunhui Yuan,Weiwei Zhao,Chengyan Xu,Jun Wei,Mingyu Li,Hongjun Ji

DOI: https://doi.org/10.1016/j.apsusc.2022.152691

IF: 6.7

2022-06-01

Applied Surface Science

Abstract:Metallic conductive nanoink with the sensitivity of temperature, oxygen, and electrochemical migration is a great challenge for printed electronics. Here, the size-controllable Cu@Ag core–shell nanoparticles (NPs) conductive films with effective cost, excellent electrical conductivity, high electrochemical migration (ECM) and oxidation resistance were obtained successfully. The novel mechanism of lower temperature sintering for Cu@Ag NPs was proposed due to radius of curvature between a large amount of tiny Ag nanobumps generated by ‘dewetting’ behavior. The Cu@Ag NPs also exhibited extreme ECM and oxidation resistance. It could remain steady in air for 40 days and hardly oxide at a high temperature of 156℃, and its failure time of ECM was 4.6 times higher than that of Ag NPs. Besides, the resistivity was up to 3.21 μΩ∙cm (55% of the bulk conductivity of Cu) even sintered at 140 °C, which enjoyed a great advantage. Ultimately, serial flexible organic light emitting diodes were integrated by high precision inkjet printing, and their excellent bending resistance and printable performance were fully exhibited. Accordingly, integrating the advantages of controllable nanoscale, lower temperature sintering, optimized conductivity, high antioxidation, excellent ECM resistance, flexibility, and printability, we enlighten the practical applications of flexible printed electronics.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
Liquid metal-enhanced composite conductive ink with improved electrical stability and durability for flexible electronics

Pucheng Wu,Hu He

DOI: https://doi.org/10.1016/j.sna.2024.115966

IF: 4.291

2024-10-15

Sensors and Actuators A Physical

Abstract:For flexible electronics, conductive ink is a critical material with diverse applications. However, conventional inks, like those based on nano-silver, are expensive and result in printed patterns with limited conductivity stability. To address these limitations and enhance overall electrical performance, stability, and durability, this study developed a novel composite conductive ink incorporating liquid metal and silver microparticles. We fabricated conductive patterns and extensively investigated the sintering process, focusing on how liquid metal content and sintering techniques affect the resulting patterns' electrical performance and stability. Our findings reveal that incorporating liquid metal introduces a slight trade-off in the initial conductivity. However, subsequent thermal and hot-press sintering treatments significantly improve conductivity, with hot-press sintering leading to the most pronounced enhancement. Furthermore, the addition of liquid metal substantially bolsters the electrical stability of the patterns. Notably, conductive patterns fabricated using a 1:1 mass ratio of the ink exhibit ∆R/R0 values of only 1.72 and 0.432 after 5000 bending cycles, following thermal and hot-press sintering, respectively. This highlights the significant improvement in electrical stability and durability achieved by incorporating liquid metal into the conductive ink.

engineering, electrical & electronic,instruments & instrumentation
One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Wei Li,Xiaoxue Xu,Wenjiang Li,Peng Liu,Yun Zhao,Qiongying Cen,Minfang Chen

DOI: https://doi.org/10.1016/j.jmrt.2019.10.039

2020-01-01

Abstract:Synthesizing metal nanoparticles (NPs) for conductive nano-ink applications on a large-scale and in a green, facile method is important. Here we use an ultrasonic-assisted method to synthesize Ag NPs with an average diameter of 15.5±1.0nm in poly(N-vinylpyrrolidone) (PVP) solutions containing ascorbic acid (Vc) and glucose as mixed reducing agents. TEM, HR-TEM and XRD analysis confirmed the purity of Ag NPs. A thin, mixed Vc and PVP layer on the surface of the Ag NPs, confirmed by TGA and FT-IR, offered the air-stability of the Ag NPs. A rapid and effective sintering method was employed to obtain highly conductive patterns and avoid substrate damage. Upon sintering, the mixed layer quickly decomposed to obtain a highly conductive net. Infrared sintering at 15W for <60s was used to make conductive patterns whose resistivity reached up to 7.4±0.5μΩcm, 4.6 times that of the bulk Ag. Three methods of the pattern designs were tested for conductivity and applicability. A sample paper-based electrode, RFID antenna, and our school logo were successfully printed and all exhibited good flexibility and conductivity. Both the synthesis and sintering process can be easily integrated into one machine, which is promising for future applications.
Room Temperature Sintering of Cu-Ag Core-Shell Nanoparticles Conductive Inks for Printed Electronics

Xiaofeng Dai,Wen Xu,Teng Zhang,Hongbin Shi,Tao Wang

DOI: https://doi.org/10.1016/j.cej.2019.01.186

IF: 15.1

2019-01-01

Chemical Engineering Journal

Abstract:The monodisperse Cu-Ag core-shell nanoparticles (Cu@Ag NPs) for electric conductive inks were successfully prepared by a simple two-step process consisting of thermal decomposition and galvanic displacement. It was found that 20 mol.% coverage of Ag enabled Cu@Ag NPs oxidation resisting with air. A new approach to achieve coalescence and sintering of Cu@Ag NPs at room temperature was proposed. 1-amino-2-propanol (MIPA), hydrophilic amine with a short C-chain, was first applied to replace the strong stabilizer, the strong stabilizer oleylamine (OAM) adsorbed on particles, thereby obtained preliminary agglomeration and hydrophobic-to-hydrophilic transition to improve the wetting capability of electrolyte solution on the surface of metal film. Then, the reducing electrolyte NaBH4 solution was used as the destabilizing agent to deeply coalesce particles, and also inhibit the electrochemical corrosion. It takes only a few minutes to achieve sintering in air at room temperature. Due to the effective sintering at room temperature, the conductive patterns could be formed on thermo-sensitive substrates. The eventual resistivity was found to be as low as 36.3 mu Omega.cm.
Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Xingwen Zhou,Wei Guo,Qian Sun,Lining Sun,Peng Peng

DOI: https://doi.org/10.1021/acsaelm.3c00509

IF: 4.494

2023-06-25

ACS Applied Electronic Materials

Abstract:Bimetallic Cu–Ag conductive structures hold great promise in integrating flexible electronics, but fabrication of these structures requires complex multistep processes with poor controllability. Herein, we develop a one-step laser writing process for manufacturing the flexible Cu–Ag conductive structure from a metallic salt. The effect of laser parameters and precursor traits on the writing process, as well as the joining mechanism of Cu–Ag nanostructures, has been discussed systematically. The fabricated Cu–Ag structure not only exhibits remarkable conductivity with a resistivity of ∼8 μΩ cm but also has excellent oxidation and electrochemical migration resistances. Flexible electronic devices fabricated from these written structures, such as the flexible heater, were demonstrated as a proof of concept, thereby demonstrating excellent stability even in high-humidity-and-temperature working conditions.

materials science, multidisciplinary,engineering, electrical & electronic
Air-stable Cu Complex Inks for Printed Electronics with High Conductivity and High Reliability

Wanli Li,Qingqing Sun,Xu-Ying Liu,Katsuaki Suganuma,Takeo Minari

DOI: https://doi.org/10.23919/icep.2019.8733423

2019-01-01

Abstract:In this work, two kinds of photonic sintering methods: laser sintering and intense pulsed light sintering are used to sinter air-stable Cu complex inks and achieve dense microstructures of Cu patterns. It is found that the microstructure of sintered Cu patterns from Cu complex inks is highly depended on the removal process of organic matter during the decomposition process. It is difficult to achieve dense and uniform microstructure of Cu pattern by using photonic sintering because of the rapid evaporation of organic matter. The introduction of the low-temperature pre-curing process before photonic sintering can drive the decomposition of Cu complex in a mild way and realize a uniform structure of Cu patterns. The subsequent intense pulsed light can further drive the sintering of Cu patterns to form a highly dense and uniform microstructure of Cu patterns and achieve high conductivity and reliability.
Synthesis of Stable Ultra-Small Cu Nanoparticles for Direct Writing Flexible Electronics

Wei Li,Minfang Chen

DOI: https://doi.org/10.1016/j.apsusc.2013.11.057

IF: 6.7

2014-01-01

Applied Surface Science

Abstract:In this study, pure Cu nanoparticles (NPs) have been successfully synthesized and the Cu nano-ink was prepared for direct writing on photo paper using a roller pen. The tri-sodium citrate was used as initial reducing-cum-surfactant agent followed by hydrazine as a second massive reducing agent and cetyltrimethylammonium bromide (CTAB) as extra surfactant agent. From the XRD, TEM, and HR-TEM analyses, the synthesized particles are confirmed to be Cu in spherical shape with sizes range of 2.5 +/- 1.0 nm. By analyzing the FT-IR spectroscopy and TGA curves, it was found that the obtained particles capped with tri-sodium citrate and CTAB layers are stable to oxidation up to the temperature 228 degrees C. The reduced size and enhanced air-stability of the Cu NPs result in an improved particle density upon sintering, which is mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered in Ar at 160 degrees C for 2 h is 7.2 +/- 0.6 mu Omega cm, which is 4.40 times the bulk Cu resistivity. The drawn Cu lines exhibited excellent integrity and good conductivity, which were experimentally tested. Moreover, a Cu electrode and a sample RFID antenna were successfully made. (C) 2013 Elsevier B. V. All rights reserved.
Synthesis and Characterization of Air-Stable Cu Nanoparticles for Conductive Pattern Drawing Directly on Paper Substrates

Wei Li,Minfang Chen,Jun Wei,Wenjiang Li,Chen You

DOI: https://doi.org/10.1007/s11051-013-1949-y

IF: 2.533

2013-01-01

Journal of Nanoparticle Research

Abstract:Air-stable Cu nanoparticles (NPs) with an average diameter of 6.5 nm were synthesized under ambient conditions using polyvinylpyrrolidone and cetyltrimethylammonium bromide as a mixed capping agent, for preparing nano-Cu ink applicable for direct writing on photo paper using a roller pen. The size, morphology, and air-stability of the Cu NPs were characterized by TEM, SEM, XRD, etc. The mixed capping agent was effective in reducing the aggregation, size of the Cu NPs and improving their air-stability. The reduced size and enhanced air-stability of the Cu NPs resulted in an improved particle density upon sintering, which was mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered at 160 °C for 2 h was 11 ± 0.8 μΩ cm, 6.40 times the bulk resistivity. A sample RFID antenna and a decorative logo were successfully made and the Cu patterns or lines exhibited excellent integrity and good conductivity, which were experimentally tested.
A Green Method for Synthesizing Novel Nanoparticles and Their Application in Flexible Conductive Patterns

Wei Li,Qiongying Cen,Wenjiang Li,Zihan Zhao,Wenlong Yang,Yuqian Li,Minfang Chen,Guang Yang,Jinjun Yang

DOI: https://doi.org/10.1016/j.jmat.2020.02.003

IF: 8.589

2020-01-01

Journal of Materiomics

Abstract:A general and unified approach to synthesize Ag, Cu and Au nanoparticles (NPs) is developed at room temperature in air atmosphere under ultrasonication in poly(N-vinylpyrrolidone) (PVP) solutions with ascorbic acid and glucose as the reducing and nucleation agents, respectively. XRD, TEM, and HR-TEM analysis of the Ag, Cu, and Au NPs confirm purity and average diameters of 15.5 +/- 2.0 nm, 50 +/- 3.0 nm, and 10 +/- 1.0 nm, respectively. An ultrasonic-assisted mechanism, wherein reduction occurs readily and produces anti-oxidation particles, is proposed and discussed. Fast infrared sintering was used to avoid damaging the substrate of conductive patterns whose resistivity at 10 W (similar to 50 degrees C) sintering power for less than 6 min reached up to 10 +/- 0.5 mU cm, 40 +/- 3.0 mU cm, and 280 +/- 5 mU cm for Ag, Cu, and Au patterns, respectively. Paper-based electrodes were produced successfully and exhibited excellent flexibility and good conductivity. The potential of this method for large scale production is discussed. (C) 2020 The Chinese Ceramic Society. Production and hosting by Elsevier B.V.
Direct Writing of Flexible Electronics Through Room Temperature Liquid Metal Ink.

Yunxia Gao,Haiyan Li,Jing Liu

DOI: https://doi.org/10.1371/journal.pone.0045485

IF: 3.7

2012-01-01

PLoS ONE

Abstract:BACKGROUND:Conventional approaches of making a flexible circuit are generally complex, environment unfriendly, time and energy consuming, and thus expensive. Here, we describe for the first time the method of using high-performance GaIn(10)-based electrical ink, a significantly neglected room temperature liquid metal, as both electrical conductors and interconnects, for directly writing flexible electronics via a rather easy going and cost effective way.METHODS:The new generation electric ink was made and its wettability with various materials was modified to be easily written on a group of either soft or rigid substrates such as epoxy resin board, glass, plastic, silica gel, paper, cotton, textiles, cloth and fiber etc. Conceptual experiments were performed to demonstrate and evaluate the capability of directly writing the electrical circuits via the invented metal ink. Mechanisms involved were interpreted through a series of fundamental measurements.RESULTS:The electrical resistivity of the fluid like GaIn(10)-based material was measured as 34.5 µΩ·cm at 297 K by four point probe method and increased with addition of the oxygen quantity, which indicates it as an excellent metal ink. The conductive line can be written with features that are approximately 10 µm thick. Several functional devices such as a light emitting diode (LED) array showing designed lighting patterns and electrical fan were made to work by directly writing the liquid metal on the specific flexible substrates. And satisfactory performances were obtained.CONCLUSIONS:The present method opens the way to directly and quickly writing flexible electronics which can be as simple as signing a name or drawing a picture on the paper. The unique merit of the GaIn(10)-based liquid metal ink lies in its low melting temperature, well controlled wettability, high electrical conductivity and good biocompability. The new electronics writing strategy and basic principle has generalized purpose and can be extended to more industrial areas, even daily life.
Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Yanlong Tai,Zhenguo Yang

DOI: https://doi.org/10.1002/sia.3839

2012-01-01

Surface and Interface Analysis

Abstract:A new kind of stable aqueous conductive ink with silver nanoflakes was developed, which was also used to fabricate conductive patterns on weighing paper for flexible electronics by direct writing. Silver nanoflakes of different sizes were characterized by transmission electron microscopy. The physical properties of the conductive ink were investigated by a dynamic contact angle system, Ubbelohde viscometer, and a surface tension instrument. Conductive properties of paper-based conductive patterns were also investigated by 4-point probe, scanning electron microscopy, X-ray diffraction and Uscan explorer with a 3D profilometer system. It is demonstrated how the formulation of conductive ink affects the surface morphology, microstructure conductivity, and line width of conductive patterns. It can be obtained that the paper-based conductive patterns have low resistivity. Especially, when the sintering condition is 200 degrees C for 20 min, the resistivity can be down to 9.4 mu Omega.cm. The application of the ink on an antenna for radio frequency identification was also studied. Copyright (C) 2011 John Wiley & Sons, Ltd.
Manufacture of Complex Pattern Flexible Copper Microcircuits Based on Silver Seeds Through Chemical Growth Welding

Zhi-Yuan Cao,Lei Chen,Le-Le Song,Ding Weng,Yuan Ma,Bo-Wen Yu,Xuan Li,Xing-Fu Shang,Jia-Dao Wang

DOI: https://doi.org/10.1039/d3nj04324j

IF: 3.3

2023-01-01

New Journal of Chemistry

Abstract:Flexible microcircuits are developing rapidly with the trends of miniaturization and foldability in modern electronic products. The chemical growth welding technique of silver seeds offers several advantages, including compatibility with a wide range of substrates, ease of operation, and room temperature growth, making it a promising method for use in the manufacturing of flexible electronics. In this paper, we demonstrated a feasible solution based on silver seeds and the chemical welding process of copper at near room temperature. The growth of copper microcircuits was directly determined by the size and distribution of silver seeds. Seeding parameters for preparing long copper microcircuits were optimized, and two types of possible defects in the as-prepared copper microcircuits were analyzed. Based on the optimized parameters, patterned fine copper microcircuits and large-area copper wires were prepared, and the conductivity and fatigue resistance were verified. The complex patterns of flexible copper microcircuits were fabricated through chemical growth welding of silver seeds at a low temperature, exhibiting good conductivity, flexibility and fatigue durability.
Preparation of Conductive Cu Patterns by Directly Writing Using Nano-Cu Ink

Wei Li,Wenjiang Li,Jun Wei,Junjun Tan,Minfang Chen

DOI: https://doi.org/10.1016/j.matchemphys.2014.02.045

IF: 4.778

2014-01-01

Materials Chemistry and Physics

Abstract:Conductive and air-stable Cu patterns were directly made on ordinary photo paper using a roller pen filled with nano-Cu ink, which was mainly composed of metallic Cu nanoparticles (NPs) capped with poly(N-vinylpyrrolidone) (PVP). The nano-Cu NPs were obtained via the reduction of Cu2+ ions by using an excess of hydrazine and PVP. The low sintering temperature (160 degrees C) in Ar atmosphere played an important role for the preparation of air-stable Cu patterns. The conductivity of a radio-frequency identification antenna made from nano-Cu ink was tested by a lamp, and its resistivity achieved 13.4 +/- 0.4 mu Omega cm. The Cu NPs were confirmed by means of X-ray powder diffraction and X-ray photo-electron spectra, and the Cu patterns were characterized by scanning electron microscopy and energy dispersive X-ray spectrometry. A mechanism for the high conductivity of the Cu pattern made from Cu NPs is proposed. (C) 2014 Elsevier B.V. All rights reserved.
Epoxy Resin-Assisted Cu Catalytic Printing for Flexible Cu Conductors on Smooth and Rough Substrates

Xiaoqiang Dou,Haoran Wang,Zihan Liu,Bowen Zheng,Zijian Zheng,Xuqing Liu,Ruisheng Guo

DOI: https://doi.org/10.1021/acsami.3c11011

IF: 9.5

2023-10-25

ACS Applied Materials & Interfaces

Abstract:Flexible copper conductors have been extensively utilized in flexible and wearable electronics. They can be fabricated by using a variety of patterning techniques such as vacuum deposition, photolithography, and various printing techniques. However, vacuum deposition and photolithography are costly and result in material wastage. Moreover, traditional printing inks require posttreatment, which can damage flexible substrates, or grafting polymers, which involve complex processes to adhere to...

materials science, multidisciplinary,nanoscience & nanotechnology

Direct Writing of Stable Cu–Ag-based Conductive Patterns for Flexible Electronics

Synthesis of stable CucoreAgshell&Ag particles for direct writing flexible paper-based electronics

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

A Promising Approach to Conductive Patterns with High Efficiency for Flexible Electronics

Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance

Liquid metal-enhanced composite conductive ink with improved electrical stability and durability for flexible electronics

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Room Temperature Sintering of Cu-Ag Core-Shell Nanoparticles Conductive Inks for Printed Electronics

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Air-stable Cu Complex Inks for Printed Electronics with High Conductivity and High Reliability

Synthesis of Stable Ultra-Small Cu Nanoparticles for Direct Writing Flexible Electronics

Synthesis and Characterization of Air-Stable Cu Nanoparticles for Conductive Pattern Drawing Directly on Paper Substrates

A Green Method for Synthesizing Novel Nanoparticles and Their Application in Flexible Conductive Patterns

Direct Writing of Flexible Electronics Through Room Temperature Liquid Metal Ink.

Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Manufacture of Complex Pattern Flexible Copper Microcircuits Based on Silver Seeds Through Chemical Growth Welding

Preparation of Conductive Cu Patterns by Directly Writing Using Nano-Cu Ink

Epoxy Resin-Assisted Cu Catalytic Printing for Flexible Cu Conductors on Smooth and Rough Substrates