Abstract:Conductive Cu patterns were constructed on flexible paper via selectively electroless plating method, which including multistep procedures, namely, 3-aminopropyltrimethoxysilane (APTMS)-modification, selective Cu0-seeding and Cu-lines deposition. Herein, the Cu0 activation process could be divided into two stages: the Cu2+-absorption in cupric citrate solution and subsequently the Cu2+-reduction using a roller pen filled with sodium borohydride ink. The interaction of APTMS onto paper was confirmed by FT-IR measurement and the results indicated that the –NH2 groups originating from APTMS were grafted on the paper. The elemental analysis of the samples in each step was conducted using XPS measurement. Paper-based conductive patterns were investigated by SEM, XRD and Scotch®-tape test. SEM images illustrated that the Cu lines on the APTMS modified paper substrate was compact and composed of ball-shaped copper nuclei. Moreover, the Cu lines could be selectively plated on the required area of the paper substrate. XRD analysis showed that the obtained Cu patterns had a structure with Cu (1 1 1) preferred orientation, revealing an excellent electromigration resistivity. The resultant Cu patterns exhibited an admired adhesion to modified paper, while the Cu patterns obtained in absence of APTMS modification suffered a failure in the adhesive Scotch®-tape test. The resistivity of copper patterns characterized by the digital four-point probe was 10.3 µΩ cm, which was 6.3 times of the bulk Cu. Meanwhile, paper-based Cu pattern remained excellent conductivity after multifolding. Those results indicated that the method proposed in the present work offered a robust and efficient alternative to manufacture flexible electronics.

Synthesis and Characterization of Air-Stable Cu Nanoparticles for Conductive Pattern Drawing Directly on Paper Substrates

Preparation of Conductive Cu Patterns by Directly Writing Using Nano-Cu Ink

Synthesis of Stable Ultra-Small Cu Nanoparticles for Direct Writing Flexible Electronics

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method

A Simple Synthesis Method of Copper Nanoparticles Applied in Conductive Ink

Fabrication of Stabilized and Dispersive Copper Nanowires Ink

Copper nanoparticle conductive patterns fabricated by thermal sintering using carboxylic acid vapors and their application for radio-frequency identification antennas

Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.

Preparation of Cu Nanoparticles by a Pulsed Wire Evaporation Process for Conductive Ink Applications

A Green Method for Synthesizing Novel Nanoparticles and Their Application in Flexible Conductive Patterns

A Novel Method of Synthesizing Antioxidative Copper Nanoparticles for High Performance Conductive Ink

Air-stable Cu Complex Inks for Printed Electronics with High Conductivity and High Reliability

Antioxidative Effect of Lactic Acid-Stabilized Copper Nanoparticles Prepared in Aqueous Solution

Preparation of Selective Conductive Copper Patterns by Pen-on-paper Writing Combined with Electroless Plating

Self-Reducible Cu Nanoparticles for Conductive Inks

Rapid Low Temperature Sintering in Air of Copper Submicron Particles with Synergistic Surface-Activation and Anti-Oxidative Protection

Enhanced Antioxidant and Size Controllable Cu@Ag Core-Shell Nanoparticles Conductive Inks for Flexible Printed Electronics

Room Temperature Sintering of Cu-Ag Core-Shell Nanoparticles Conductive Inks for Printed Electronics