Abstract:Stretchable electronics can be realized using different manufacturing methods and hybrids thereof. An example of the latter is the combination of stretchable circuit boards with screen-printing, which will be discussed in this work. The hybrid stretchable electronics structures are based on photolithographically structured and rigid copper islands and screen-printed silver ink interconnections. This enables the assembly of components with a high number of contacts onto the copper islands and deformable silver ink lines between islands. The transition area between islands and lines is critical due to local stress concentration. The effect and potential mitigations were studied by measuring the electrical resistance of test interconnections under mechanical loading. The first set of samples was elongated up to 30 % in tensile tests. The second set of samples was elongated 10 %, 20 %, and 30 % in cyclic tests up to 10.000 cycles. After the tests, extensive failure analysis, e.g., scanning electron microscope, and finite element analysis were conducted. In tensile tests at maximum load, the interconnections either snap apart or their resistance increases by 640 % in the transition area. Adding protective structures around the transition area, the resistance increase can be reduced to 12 %. Stress concentration in the transition area can be controlled with the layout of the structures, as shown in the cyclic tests. Depending on a layout, the structures protect interconnections in the transition area (resistance < 4 Ω at 10 % and 20 % throughout 10.000 cycles, and up to 5000 cycles at 30 % elongation), or with particular designs, cause fatal damage of the circuitry and fail early. The identified failure mechanism is typically fatigue damage caused by the repeated bending of the protective structure. The observed resistance increase at the interface was closely related to the crack propagation phase in the protective structures.

Manufacture of Complex Pattern Flexible Copper Microcircuits Based on Silver Seeds Through Chemical Growth Welding

Manufacture of Complex Pattern Flexible Copper Microcircuits Based on Silver Seeds Chemical Growth Welding

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates

Flexible Copper Wires Through Galvanic Replacement of Zinc Paste: a Highly Cost-Effective Technology for Wiring Flexible Printed Circuits

Synthesis of stable CucoreAgshell&Ag particles for direct writing flexible paper-based electronics

Directly Electroplated Metallization on Flexible Substrates Based on Silver Nanowire Conductive Composite for Wearable Electronics

High-reproducibility, Flexible Conductive Patterns Fabricated with Silver Nanowire by Drop or Fit-to-flow Method

A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing

Semi-liquid Metal and Adhesion-Selection Enabled Rolling and Transfer (SMART) Printing: A General Method Towards Fast Fabrication of Flexible Electronics

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Flexible Substrates Enabled Highly Integrated Patterns with Submicron Precision Toward Intrinsically Stretchable Circuits

Ultraviolet curing technology plus chemical copper plating: A novel method for producing highly durable fabric‐based flexible circuit

Localized electrodeposition micro additive manufacturing of pure copper microstructures

Unraveling the Mechanism of Plasma‐Induced Curing of Particle‐Free Complex Inks for Manufacturing of High‐Performance Flexible Copper Films and Patterns

Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

Mechanical properties of structured copper and printed silver hybrid stretchable electronic systems

Fabrication of Flexible Conductive Composites Based on Copper Nanowires

Highly transparent and flexible circuits through patterning silver nanowires into microfluidic channels

Semi-liquid Metal enabled Highly Conductive Wearable Electronics for Smart Fabrics.

Site-selective Fabrication of Patterned Transparent Copper Mesh on Flexible Substrates at Mild Temperature for Green, Low Cost Electronics