Ultraviolet curing technology plus chemical copper plating: A novel method for producing highly durable fabric‐based flexible circuit

Maojiang Zhang,Kexin Cui,Xinwei Zhang,Jinghua Wang,Minglei Wang,Yanfu Wu,Chunlei Dong,Jie Gan,Jiangtao Hu,Guozhong Wu
DOI: https://doi.org/10.1002/pat.6563
IF: 3.348
2024-09-13
Polymers for Advanced Technologies
Abstract:The construction of flexible circuits is a crucial and challenging aspect in the design and fabrication of fabric‐based flexible electronics, which hold significant potential for various applications. In this study, we successfully developed high‐precision and durable fabric‐based flexible circuits by ingeniously combining ultraviolet light (UV)‐curing technology with chemical plating. Specifically, a UV coating containing Ag/Fe3O4 catalysts was applied onto polyester fabric surface, followed by printing the designed circuit structure diagram onto the fabric using UV light‐directed curing of the coating, and fabric‐based flexible circuits were then fabricated through chemical plating process. The fabric‐based flexible circuits exhibit only minimal increases in resistance following durability testing, including bending (8000 times), abrasion (2000 times), high and low temperature stability (−30 to 60°C), and high temperature/humidity stability (65°C, RH = 95%, 48 h), which remains consistently stable. This developed technology holds immense potential across various applications for smart wearable devices.
polymer science
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