Preparation of Cu Nanoparticles by a Pulsed Wire Evaporation Process for Conductive Ink Applications

Dong-Jin Lee,Fan-Long Jin,Soo-Jin Park
DOI: https://doi.org/10.1007/s12034-018-1725-9
IF: 1.878
2019-01-01
Bulletin of Materials Science
Abstract:In the present study, Cu colloidal nanoparticles and nanopowders were successfully synthesized by a pulsed wire evaporation process. Cu-based nano-inks were prepared by mixing Cu nanoparticles with acrylic resin and solvent. Cu nanoparticles with a particle size of < 20 nm were uniformly dispersed in ethylene glycol. The Cu nanopowders were successfully coated with an organic solvent composed of a hydrocarbon compound. This organic coating effectively inhibited the oxidation of Cu nanopowders. In addition, the stability of dispersion of Cu nanoparticles in the inks was improved by a ball-milling process. The electrical conductivity of the prepared Cu nano-inks was 10–28 \(\upmu \)S cm\(^{-1}\) for 20–40 wt% of Cu.
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