Abstract:Conductive inks are one of the most important functional materials for printed flexible electronic devices, and their properties determine the methods of subsequent patterning and metallization. In comparison with copper nanoparticle or nanowire inks, copper particle-free inks employing copper(II) formate (Cuf) as a precursor have attracted the interest of researchers due to their flexibility in preparation, excellent stability, and lower conversion temperature. Alkanolamines can provide Cuf with excellent solubility in alcohols while being less toxic and having a certain reducibility, making them preferable ligands in comparison with aliphatic amines and pyridine. However, there have been few studies on the effects of the alkanolamine types on the performance of Cuf inks. Also, the decomposition mechanism of copper-alkanolamine complex inks is not clear. In this work, different kinds of alkanolamines were chosen as ligands to formulate Cuf inks to address the mentioned issues. The influences of amine types on the stability, wettability, thermal decomposition behavior, and electrical performance of the formulated Cuf particle-free inks were investigated in detail. The results show that the utilization of alkanolamines could provide Cuf with excellent solubility in alcohols, resulting in an ink with good stability and favorable wetting properties. The thermal decomposition temperature and electrical performance of the formulated copper ink are largely dependent on the amine used. When amines with a longer carbon chain and more branches were utilized to prepare the ink, a decreased decomposition temperature was observed on the derived inks because of the steric hindrance effect. Copper films with good morphology and conductivity could be obtained at low temperatures by selecting the appropriate alkanolamine. Copper particle-free conductive ink from 2-amino-2-methyl-1-propanol demonstrated better morphology and electrical performance (16.09 μΩ·cm) and was successfully used for conductive circuits by direct-writing.

The Rise of Conductive Copper Inks: Challenges and Perspectives

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

Self-reducible copper ion complex ink for air sinterable conductive electrodes

A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics

Air-stable Cu Complex Inks for Printed Electronics with High Conductivity and High Reliability

Functional Electronic Inks

Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

Advances in the Development of Liquid Metal-Based Printed Electronic Inks

Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink

Antioxidative Effect of Lactic Acid-Stabilized Copper Nanoparticles Prepared in Aqueous Solution

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Silver Nanoparticles for Conductive Inks: From Synthesis and Ink Formulation to Their Use in Printing Technologies

Recent advances in conductive materials for printed electronics and printed technology

The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method

A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology

One step preparation of copper–silver self-catalyzed hybrid conductive ink with reduced sintering temperature for flexible electronics