Abstract:Silicone, alkyne and naphthalene groups are introduced into polyimides to obtain novel polyimides with good thermal and processing properties. Asymmetric diamine (3-aminophenyl)-(4'-aminophenyl)-acetylene (AMPA) and 3-(naphthalene-1-acetylene) aniline (NAA) naphthalene rings were synthesized by Sonogashira reaction. Then using AMPA, NAA, bis(3,4-dicarboxyphenyl) dimethylsilane di-anhydride, 4,4'-diphthalic anhydride (ODPA) and m-aminobenzene (APA) as raw materials, a series of polyimide resins PI-Si-I (APA as the terminating agent) and PI-Si-II (NAA as the terminating agent) containing silicon and endoalkynyl groups in molecular chains were prepared with control group PI-O-I and PI-O-II (ODPA as the monomer of dianhydride). The PI-Si resins had high solubility in common solvents such as tetrahydrofuran (THF), low melt viscosity and wide processing window of Pi-Si-II resin. The processing window of resin was 100 degrees C. The curing thermal behaviors of the resins were tracked by differential scanning calorimetry (DSC). The results showed that each resin had two curing peaks, the first peak appeared in the range of 285-328 degrees C with the peak temperature at 311 degrees C, and the second peak appeared in the range of 350-422 degrees C with its second peak temperature at 390 degrees C. The thermogravimetric test showed that the T-d5 of cured resin was 547 degrees C, and the R-800 degrees C exceeded 79%, suggesting their excellent heat resistance. The thermal cracking analysis of the cured resins showed that the silico-oxy-silicon structure, benzene ring and naphthalene ring rigid structures were formed when silicomethyl and acetylene groups were introduced into the main polyimide chain at high temperature, which improved the heat resistance of the resin. [GRAPHICS] .

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