Abstract:Polyimide (PI) materials with a low coefficient of thermal expansion (CTE) while still retaining high strength and toughness are desirable in various applications. In this study a sol–gel process was used to incorporate silica into homopolyimides and copolyimides with highly rigid structures in an attempt to pursue this aim. A number of highly rigid monomers were used, including pyromellitic dianhydride (PMDA), p-phenylene diamine (PPA), m-phenylene diamine (MPA), benzidine, 2,4-diaminotoluene, and o-toluidine. No homopolyimide flexible films were obtained. However, it was possible to obtain flexible films from the copolyimides. Therefore, a copolyimide based on PPA, MPA, and PMDA (PPA/MPA = 2/1 mol) was then chosen as the matrix to prepare the PI/silica hybrids. Flexible films were obtained when the silica content was below 40 wt %. The hybrid films possessed low in-plane CTEs ranging from 14.9 to 31.1 ppm with the decrease of the silica content. The copolyimide film was strengthened and toughened with the introduction of an appropriate amount of silica. The thermal stability and the Young's modulus of the hybrid films increased with the increase of the silica content. The silica particle size was assessed by scanning electron microscopy and was about 100 nm for the hybrids containing 10 and 20 wt % silica and 200–500 nm for the hybrids containing 30 and 40 wt % silica. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 794–800, 2001

Properties of Polyimide/Silica Nanohybrids from Silicic Acid Oligomer

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

PREPARATION AND STUDY ON STRUCTURE OF THE POLYIMIDE/SILICA HYBRID AND NANOCOMPOSITE FILMS

Preparation and Dielectric Properties of Polyimide/silica Nanocomposite Films Prepared from Sol–gel and Blending Process

Synthesis and Characterization of Nanocomposite of Polyimide-Silica Hybrid from Nonaqueous Sol-Gel Process

Novel Polyimide/Silica Nanohybrids from Water Glass

Synthesis, Characterisation and Enhanced Properties of Polyimide/mica Hybrid Films

Synthesis, Characterization and Properties of Sio2-Polyimide Hybrid Film

Synthesis and Characterization of Polyimide/Silica Nanocomposite Films

Comparison of Hybrid Polyimide Films with Silica and Organosilica Obtained Via Sol–gel Process

Structure and Mechanical Properties of the Hybrid Films of Well Dispersed SiO2 Nanoparticle in Polyimide (pi/sio2) Prepared by Sol–gel Process

Preparation and Properties of Rigid‐rod Polyimide/silica Hybrid Materials by Sol–gel Process

Polyimide/silica/titania Nanohybrids Via a Novel Non-Hydrolytic Sol–gel Route

Preparation and mechanical properties of novel polyimide/T-silica hybrid films

Synthesis And Characterization Of Silica-Alumina Co-Doped Polyimide Film

Silica/polyimide Nanocomposite Films

Molecular Dynamics Simulation Study on the Structure and Properties of Polyimide/silica Hybrid Materials

Advances in Polyimide Hybrid Materials with Nanometer SiO2

Imparting low dielectric constant and high modulus to polyimides via synergy between coupled silsesquioxanes and crown ethers

Dielectric and conduction properties of polyimide/silica nano-hybrid films

Preparation and Characterization of Polyimide/pure Silica Zeolite Hybrid Films