Abstract:Silica tubes (T-silica) with uniform size and large aspect ratios were synthesized by hydrolyzing tetraethyl orthosilicate using D,L-tartaric acid as a template. The prepared silica tubes have a diameter of about 200-400 nm and a length of about 40-100 mu m; hence, their aspect ratios range from 100 to 500. The inner shape of the silica tubes is rectangular, and their wall thickness is 100-150 nm. T-silica/polyimide (PI) composite films were prepared from a solution of a PI precursor (polyamic acid) and silica tubes modified by a coupling agent (gamma-aminopropyltriethoxy silane, KE-550). The overall performance including tensile strength, ductility, tearing strength, thermal expansion and diffusivity, and volume and surface resistivities of the T-silica/PI composite films were examined as a function of the T-silica content. It is interesting to note that the tensile strength and ductility have been simultaneously improved; tearing strength has also been enhanced; thermal expansion and diffusivity have been simultaneously decreased; and both volume and surface resistivities have been dramatically enhanced by the introduction of T-silica in proper amounts into the PI matrix. Moreover, the composite films containing silica tubes have low densities that range from 1.408 to 1.447 g/cm(3). These suggest that templated silica tubes are very effective in enhancing the overall performance of the PI composite films that have a great potential to be used as electrical and thermal insulating materials in high tech areas such as aircraft and spacecraft manufacture and so forth, where high strength and ductility, high tearing strength, low thermal expansion and diffusivity, high resistivities, light weight, and so forth are desirable.

Preparation and mechanical properties of novel polyimide/T-silica hybrid films

PREPARATION AND STUDY ON STRUCTURE OF THE POLYIMIDE/SILICA HYBRID AND NANOCOMPOSITE FILMS

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

Preparation and Dielectric Properties of Polyimide/silica Nanocomposite Films Prepared from Sol–gel and Blending Process

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Synthesis and Characterization of Polyimide/Silica Nanocomposite Films

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Preparation and Characterization of Polyimide/Alumina Composite Films As Improved Solid Dielectrics

Structure and Mechanical Properties of the Hybrid Films of Well Dispersed SiO2 Nanoparticle in Polyimide (pi/sio2) Prepared by Sol–gel Process

Comparison of Hybrid Polyimide Films with Silica and Organosilica Obtained Via Sol–gel Process

Effects of Coupling Agent on Morphology and Properties of Polyimide/ SiO2-Al2O3 Hybrid Films

Preparation of Inorganic Nanoparticles/Polyimide Hybrid Film by Sol Gel Method

Synthesis And Electric Properties Of Nano-Hybrid Polyimide/Silica Film

Effect of Alumina on the Structure and Properties of Polyimide Matrix Films

Polyimide/silica/titania Nanohybrids Via a Novel Non-Hydrolytic Sol–gel Route

Microstructure and Properties of Organosoluble Polyimide/silica Hybrid Films

Preparation of Polyimide/silica-Alumina Hybrid Film