Equivalent Surface Impedance-Based Mixed Potential Integral Equation Accelerated by Optimized $\cal {H}$ -Matrix for 3-D Interconnects

Yu Zhao,Jun-Fa Mao
DOI: https://doi.org/10.1109/TMTT.2017.2731956
IF: 4.3
2018-01-01
IEEE Transactions on Microwave Theory and Techniques
Abstract:The equivalent surface impedance (ESI)-based mixed potential integral equation (MPIE) is proposed in this paper for parameter extraction of 3-D interconnects. Boundary integral equations (BIEs) describing the conductor region and the nonconductor region are utilized to derive the ESI model, which incorporates with an MPIE to simplify the electromagnetic simulation. For large-scale problems, the so...
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