Novel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnects

Yu Zhao,Feng Ling,Jun-Fa Mao
DOI: https://doi.org/10.1109/LMWC.2016.2630842
IF: 3
2017-01-01
IEEE Microwave and Wireless Components Letters
Abstract:A novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors d...
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