Abstract:A complete multiple reciprocity method (CMRM), usually employed for the eigenvalue analysis of Helmholtz equation, is applied to impedance calculation of 3D electric structures for multiple frequency points. Based on a recently proposed boundary integral formulations for impedance calculation, the CMRM is used to separate the boundary integrals into the frequency-dependent and frequency-independent portions so as to accelerate the computation for multiple frequency points. A set of approaches is proposed to handle the severe numerical problems induced by the large varieties of distance r and frequency-dependent k, when applying the CMRM to impedance calculation. As a result, the near-field integrals are calculated with the inner product of a frequency-independent sequence and a frequency-dependent sequence, while the far-field integrals are calculated with an efficient approximate formula. Since the majority of the calculation for generating the overall linear equation system becomes reusable, the impedance extraction with multiple frequency points is greatly accelerated. Several typical structures of interconnects are calculated with the boundary element method combined with CMRM. Numerical results verify the accuracy and efficiency of the proposed methods.

An Algorithm Based on Mixed Boundary Element Integral Formulations for Extracting Frequency-Dependent Impedances of 3D VLSI Interconnects

Capacitance extraction of high-density 3D interconnects using finite element method

Efficient Extraction of the Frequency-Dependent K Element and Resistance of VLSI Interconnects

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

COMBING MULTILEVEL GREEN'S FUNCTION INTERPOLATION METHOD WITH VOLUME LOOP BASES FOR INDUCTANCE EXTRACTION PROBLEMS

Fast multi-frequency extraction of 3D impedance based on boundary element method

Efficient Techniques for 3-D Impedance Extraction Using Mixed Boundary Element Method

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Novel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnects

A mixed boundary element method for extracting frequency-dependent inductances of 3D interconnects

Efficient DC and AC Impedance Calculation for Arbitrary-Shape and Multilayer PDN Using Boundary Integration

A Mixed Surface Integral Formulation for Frequency-Dependent Inductance Calculation of 3D Interconnects

A Generalized algorithm for the capacitance extraction of 3-D VLSI interconnects

Calculating Frequency-Dependent Inductance of VLSI Interconnect by Complete Multiple Reciprocity Boundary Element Method

An Efficient 3D Reluctance Extractor for On-Chip Interconnects

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

An efficient algorithm for the parameter extraction of 3-D interconnect structures in the VLSI circuits: domain-decomposition method

Electromagnetic Modelling and Transient Simulation of Interconnects in High Speed VLSI Circuits

Fast Analysis of Interconnect Structures Based on Volume-Surface Integral Equations

Study on Extraction of Capacitance Parameters of Three Dimensional Interconnect Structures Based on Finite Element Method

Application of the complete multiple reciprocity method for 3D impedance extraction with multiple frequency points